Bonding and separation behaviors between Ti-Sn alloys and high carbon steel

Yasuhiro Morizono, Seiichiro Nakatsukasa, Minoru Nishida

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Ti-Sn binary alloys (Ti-5 to 20 mol% Sn) were diffusion-bonded to high carbon steel between 1073 and 1273 K for 3.6 ks in a vacuum to investigate the influence of the alloy composition on the interfacial microstructures. Ti-5 and 10 mol% Sn alloys were attached firmly to the steel at a bonding temperature of 1273 K. A continuous TiC layer was formed along the interface, while voids were observed between the TiC layer and the steel. Although the joints with Ti-15 and 20 mol% Sn alloys were also prepared at 1273 K, these joints separated near the interface after the bonding treatment. The TiC layer was formed in the separated surface of Ti-Sn alloy, and Fe in the steel diffused into the Ti-Sn alloy. This indicates that the Ti-15 and 20 mol% Sn alloys established contact with the steel at elevated temperatures until just before the separation. The specimens bonded at 1173 K also denoted the same tendency. However, the Ti-15 mol% Sn/steel joint bonded at 1073 K showed a shear strength of more than 50 MPa. The mechanism and the application of the interface separation are discussed on the basis of the microstructural observations.

Original languageEnglish
Title of host publicationTHERMEC 2009
EditorsTara Chandra, Tara Chandra, Tara Chandra, N. Wanderka, N. Wanderka, N. Wanderka, Walter Reimers, Walter Reimers, Walter Reimers, M. Ionescu, M. Ionescu, M. Ionescu
PublisherTrans Tech Publications Ltd
Pages3787-3792
Number of pages6
ISBN (Print)0878492941, 9780878492947
DOIs
Publication statusPublished - 2010
Event6th International Conference on Processing and Manufacturing of Advanced Materials - THERMEC'2009 - Berlin, Germany
Duration: Aug 25 2009Aug 29 2009

Publication series

NameMaterials Science Forum
Volume638-642
ISSN (Print)0255-5476
ISSN (Electronic)1662-9752

Other

Other6th International Conference on Processing and Manufacturing of Advanced Materials - THERMEC'2009
CountryGermany
CityBerlin
Period8/25/098/29/09

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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