Challenges of Optical MEMS Packaging

Renshi Sawada

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)338-341
Number of pages4
JournalJournal of Japan Institute of Electronics Packaging
Volume9
Issue number5
DOIs
Publication statusPublished - Jan 1 2006

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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