Challenges of Optical MEMS Packaging

Renshi Sawada

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)338-341
Number of pages4
JournalJournal of Japan Institute of Electronics Packaging
Volume9
Issue number5
DOIs
Publication statusPublished - Jan 1 2006

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MOEMS
Packaging

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Cite this

Challenges of Optical MEMS Packaging. / Sawada, Renshi.

In: Journal of Japan Institute of Electronics Packaging, Vol. 9, No. 5, 01.01.2006, p. 338-341.

Research output: Contribution to journalArticle

Sawada, Renshi. / Challenges of Optical MEMS Packaging. In: Journal of Japan Institute of Electronics Packaging. 2006 ; Vol. 9, No. 5. pp. 338-341.
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