Challenges of Optical MEMS Packaging

Renshi Sawada

    Research output: Contribution to journalArticlepeer-review

    Original languageEnglish
    Pages (from-to)338-341
    Number of pages4
    JournalJournal of Japan Institute of Electronics Packaging
    Volume9
    Issue number5
    DOIs
    Publication statusPublished - Jan 1 2006

    All Science Journal Classification (ASJC) codes

    • Electrical and Electronic Engineering

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