Characteristics of the plasma parameters in the fabrication of microcrystalline silicon thin films using 915 MHz ECR plasma

Doan Ha Thang, K. Sasaki, H. Muta, Naho Itagaki, Y. Kawai

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

Plasma parameters in the fabrication of μc-Si thin films using 915 MHz ECR plasma with SiH4/H2 mixtures were investigated experimentally. Plasma parameters such as electron temperature and ion density were measured by a heated Langmuir probe. The deposition rate and the volume fraction of μc-Si were measured by spectrophotometer and Raman spectroscopy, respectively. As a result, it was observed that the characteristics of plasma parameters in SiH4/H2 plasma were different with those in H2 plasma although the concentration of SiH4 was only about 0.1. In addition, it was found that relatively high deposition rate can be realized even under the condition of both low gas pressure and low gas flow rate.

Original languageEnglish
Pages (from-to)485-488
Number of pages4
JournalThin Solid Films
Volume506-507
DOIs
Publication statusPublished - May 26 2006
Externally publishedYes

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry

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