Abstract
Three-dimensional structure of crack tip dislocations were investigated by combining scanning transmission electron microscopy (STEM) and electron tomography (ET) in silicon single crystals. P-type (001) silicon single crystals were employed. <110> cracks were introduced from an indent on the (001) surface. The specimen was heated at 873K in order to introduce dislocations at the crack tips. The specimen was thinned to include the crack tip in the foil by an iron milling machine. STEM-ET observation revealed the three-dimensional structure of crack tip dislocations. Their Burgers vectors were determined by using an invisibility criterion. The local stress intensity factor was calculated using the dislocation characters obtained in the observation in this study, indicating that the dislocations observed were mode II shielding type dislocations.
| Original language | English |
|---|---|
| Title of host publication | PRICM7 |
| Pages | 2307-2311 |
| Number of pages | 5 |
| Volume | 654-656 |
| DOIs | |
| Publication status | Published - 2010 |
| Event | 7th Pacific Rim International Conference on Advanced Materials and Processing, PRICM-7 - Cairns, QLD, Australia Duration: Aug 2 2010 → Aug 6 2010 |
Publication series
| Name | Materials Science Forum |
|---|---|
| Volume | 654-656 |
| ISSN (Print) | 02555476 |
Other
| Other | 7th Pacific Rim International Conference on Advanced Materials and Processing, PRICM-7 |
|---|---|
| Country | Australia |
| City | Cairns, QLD |
| Period | 8/2/10 → 8/6/10 |
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All Science Journal Classification (ASJC) codes
- Materials Science(all)
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering
Cite this
Characterization of crack-tip dislocations and their effects on materials fracture. / Higashida, Kenji; Tanaka, Masaki; Sadamatsu, Sunao.
PRICM7. Vol. 654-656 2010. p. 2307-2311 (Materials Science Forum; Vol. 654-656).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Characterization of crack-tip dislocations and their effects on materials fracture
AU - Higashida, Kenji
AU - Tanaka, Masaki
AU - Sadamatsu, Sunao
PY - 2010
Y1 - 2010
N2 - Three-dimensional structure of crack tip dislocations were investigated by combining scanning transmission electron microscopy (STEM) and electron tomography (ET) in silicon single crystals. P-type (001) silicon single crystals were employed. <110> cracks were introduced from an indent on the (001) surface. The specimen was heated at 873K in order to introduce dislocations at the crack tips. The specimen was thinned to include the crack tip in the foil by an iron milling machine. STEM-ET observation revealed the three-dimensional structure of crack tip dislocations. Their Burgers vectors were determined by using an invisibility criterion. The local stress intensity factor was calculated using the dislocation characters obtained in the observation in this study, indicating that the dislocations observed were mode II shielding type dislocations.
AB - Three-dimensional structure of crack tip dislocations were investigated by combining scanning transmission electron microscopy (STEM) and electron tomography (ET) in silicon single crystals. P-type (001) silicon single crystals were employed. <110> cracks were introduced from an indent on the (001) surface. The specimen was heated at 873K in order to introduce dislocations at the crack tips. The specimen was thinned to include the crack tip in the foil by an iron milling machine. STEM-ET observation revealed the three-dimensional structure of crack tip dislocations. Their Burgers vectors were determined by using an invisibility criterion. The local stress intensity factor was calculated using the dislocation characters obtained in the observation in this study, indicating that the dislocations observed were mode II shielding type dislocations.
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UR - http://www.scopus.com/inward/citedby.url?scp=77955495416&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/MSF.654-656.2307
DO - 10.4028/www.scientific.net/MSF.654-656.2307
M3 - Conference contribution
SN - 0878492550
SN - 9780878492558
VL - 654-656
T3 - Materials Science Forum
SP - 2307
EP - 2311
BT - PRICM7
ER -