TY - JOUR
T1 - Chemical mechanical polishing of patterned copper wafer surface using water-soluble fullerenol slurry
AU - Takaya, Y.
AU - Kishida, H.
AU - Hayashi, T.
AU - Michihata, M.
AU - Kokubo, K.
N1 - Funding Information:
This research was supported by the Ministry of Education, Science, Sports and Culture , through a Grant-in-Aid for Scientific Research (B), 21360064 , 2010.
Copyright:
Copyright 2011 Elsevier B.V., All rights reserved.
PY - 2011
Y1 - 2011
N2 - Cu-CMP has become a key fabrication process by which high-performance semiconductor devices are realized. Therefore, a novel Cu-CMP technique using water-soluble fullerenol slurry was developed. The experimental results show that the proposed Cu-CMP technique realizes a high material removal rate and low dishing performance for the polishing of a patterned Cu-wafer. An XPS analysis and SEM observation showed that these advantageous polishing performances were achieved by the chemical effect of using fullerenol as a polishing agent. The fullerenol was found to chemically react with the copper to form a complex brittle layer which was fragile enough to be removed by rubbing with a polishing pad.
AB - Cu-CMP has become a key fabrication process by which high-performance semiconductor devices are realized. Therefore, a novel Cu-CMP technique using water-soluble fullerenol slurry was developed. The experimental results show that the proposed Cu-CMP technique realizes a high material removal rate and low dishing performance for the polishing of a patterned Cu-wafer. An XPS analysis and SEM observation showed that these advantageous polishing performances were achieved by the chemical effect of using fullerenol as a polishing agent. The fullerenol was found to chemically react with the copper to form a complex brittle layer which was fragile enough to be removed by rubbing with a polishing pad.
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U2 - 10.1016/j.cirp.2011.03.068
DO - 10.1016/j.cirp.2011.03.068
M3 - Article
AN - SCOPUS:79957631517
VL - 60
SP - 567
EP - 570
JO - CIRP Annals - Manufacturing Technology
JF - CIRP Annals - Manufacturing Technology
SN - 0007-8506
IS - 1
ER -