TY - GEN
T1 - CMOS class-E power amplifier module with CPW bonding wires for 5GHz application
AU - Kanaya, Haruichi
N1 - Funding Information:
This work was partly supported by KAKENHI from Japan Science and Technology Agency, JST.
Publisher Copyright:
© 2017 Japan Institute of Electronics Packaging.
Copyright:
Copyright 2017 Elsevier B.V., All rights reserved.
PY - 2017/6/5
Y1 - 2017/6/5
N2 - This paper presents a CMOS class-E power amplifier (PA) with high efficiency for 5GHz band wireless-mesh-network system using constant envelope modulation scheme. The proposed class-E PA employs injection-locking technique and parasitic compensation to reduce the required DC input power. This PA is realized by using 0.18 um CMOS process. This PA is placed on the lead frame and molded in the package for transmitter application. In our design, the position and length of the bonding wires are optimized by using EM simulation. In addition, a coplanar waveguide (CPW) structure was realized by the bonding wires in the RF port. Our PA module has a measured PAE = 41.0 %.
AB - This paper presents a CMOS class-E power amplifier (PA) with high efficiency for 5GHz band wireless-mesh-network system using constant envelope modulation scheme. The proposed class-E PA employs injection-locking technique and parasitic compensation to reduce the required DC input power. This PA is realized by using 0.18 um CMOS process. This PA is placed on the lead frame and molded in the package for transmitter application. In our design, the position and length of the bonding wires are optimized by using EM simulation. In addition, a coplanar waveguide (CPW) structure was realized by the bonding wires in the RF port. Our PA module has a measured PAE = 41.0 %.
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U2 - 10.23919/ICEP.2017.7939365
DO - 10.23919/ICEP.2017.7939365
M3 - Conference contribution
AN - SCOPUS:85021403071
T3 - 2017 International Conference on Electronics Packaging, ICEP 2017
SP - 237
EP - 238
BT - 2017 International Conference on Electronics Packaging, ICEP 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2017 International Conference on Electronics Packaging, ICEP 2017
Y2 - 19 April 2017 through 22 April 2017
ER -