CMP characteristics and mechanisms of glass substrate by both conventional cerium oxide (CeO2) slurry and new manganese oxide slurry for replacing CeO2 abrasive

Tsutomu Yamazaki, Toshiro K. Doi, Syuhei Kurokawa, Osamu Ohnishi, Michio Uneda, Yoji Umezaki, Yasuhide Yamaguchi, Sadahiro Kishii

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

Cerium Oxide (CeO2) slurry is frequently used for making high precision surface finishes of glass substrate applied for Hard Disk Drive (HDD) and Flat Display (FD). However, CeO2 is one of the rare metals. Therefore, both reduction of supply amount of CeO2 slurry and development of new slurry without CeO2 need to be improved. This paper presents the optimum CMP conditions applying CeO2 slurry as a parameter of slurry concentration, polishing pressure and platen rotational speed. Moreover, we discuss the advantages of Manganese Oxide (Mn 2O3) abrasive for replacing CeO2 abrasive. In the result, it is found experimentally that the proposed conditions are efficient in reduction of CeO2 abrasive. Moreover, Mn 2O3 abrasive indicates optimum performance for the polishing of glass substrates.

Original languageEnglish
Pages (from-to)960-965
Number of pages6
JournalSeimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Volume77
Issue number10
DOIs
Publication statusPublished - Jan 1 2011

All Science Journal Classification (ASJC) codes

  • Mechanical Engineering

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