CMP characteristics of quartz glass substrate by aggregated colloidal ceria slurry

Kaito Wakamatsu, Syuhei Kurokawa, Takaaki Toyama, Terutake Hayashi

Research output: Contribution to journalArticle

Abstract

Colloidal ceria is expected to be a candidate of alternative slurry for glass substrate CMP because the slurry particles are small and have a regular shape comparing to conventional calcined ceria particles. Thanks to the characteristics, the colloidal ceria can generate a high quality surface in glass substrate CMP, but removal rate (RR) is smaller than that of calcined ceria. In order to improve the RR, KOH was added to the colloidal ceria. KOH additives make colloidal ceria particles aggregate and improve RR close to that of calcined ceria. By evaluating the extent of aggregation with and without ultrasonic dispersion, it was found there was a strong correlation with KOH concentration to aggregation strength and RR. To obtain further RR and to reduce the consumption of slurry, influence of polishing pressure and slurry concentration on polishing characteristics was investigated. As the polishing pressure increased, the RR improved, while slurry residue occurred partly on the edge of the substrate surface. The slurry residue was restrained by decreasing slurry concentration. Furthermore, although scratches in the nanometer order increase slightly under high polishing pressure, they are smaller than those by calcined ceria slurry. By controlling the degree of aggregation of colloidal ceria, we have achieved both high RR and high quality surface.

Original languageEnglish
Pages (from-to)458-464
Number of pages7
JournalPrecision Engineering
Volume60
DOIs
Publication statusPublished - Nov 1 2019

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Cerium compounds
Quartz
Glass
Substrates
Polishing
Agglomeration
Surface properties
Ultrasonic dispersion

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Cite this

CMP characteristics of quartz glass substrate by aggregated colloidal ceria slurry. / Wakamatsu, Kaito; Kurokawa, Syuhei; Toyama, Takaaki; Hayashi, Terutake.

In: Precision Engineering, Vol. 60, 01.11.2019, p. 458-464.

Research output: Contribution to journalArticle

@article{8dc144dd4f354a1d8bc6ef8e197bffda,
title = "CMP characteristics of quartz glass substrate by aggregated colloidal ceria slurry",
abstract = "Colloidal ceria is expected to be a candidate of alternative slurry for glass substrate CMP because the slurry particles are small and have a regular shape comparing to conventional calcined ceria particles. Thanks to the characteristics, the colloidal ceria can generate a high quality surface in glass substrate CMP, but removal rate (RR) is smaller than that of calcined ceria. In order to improve the RR, KOH was added to the colloidal ceria. KOH additives make colloidal ceria particles aggregate and improve RR close to that of calcined ceria. By evaluating the extent of aggregation with and without ultrasonic dispersion, it was found there was a strong correlation with KOH concentration to aggregation strength and RR. To obtain further RR and to reduce the consumption of slurry, influence of polishing pressure and slurry concentration on polishing characteristics was investigated. As the polishing pressure increased, the RR improved, while slurry residue occurred partly on the edge of the substrate surface. The slurry residue was restrained by decreasing slurry concentration. Furthermore, although scratches in the nanometer order increase slightly under high polishing pressure, they are smaller than those by calcined ceria slurry. By controlling the degree of aggregation of colloidal ceria, we have achieved both high RR and high quality surface.",
author = "Kaito Wakamatsu and Syuhei Kurokawa and Takaaki Toyama and Terutake Hayashi",
year = "2019",
month = "11",
day = "1",
doi = "10.1016/j.precisioneng.2019.06.014",
language = "English",
volume = "60",
pages = "458--464",
journal = "Precision Engineering",
issn = "0141-6359",
publisher = "Elsevier Inc.",

}

TY - JOUR

T1 - CMP characteristics of quartz glass substrate by aggregated colloidal ceria slurry

AU - Wakamatsu, Kaito

AU - Kurokawa, Syuhei

AU - Toyama, Takaaki

AU - Hayashi, Terutake

PY - 2019/11/1

Y1 - 2019/11/1

N2 - Colloidal ceria is expected to be a candidate of alternative slurry for glass substrate CMP because the slurry particles are small and have a regular shape comparing to conventional calcined ceria particles. Thanks to the characteristics, the colloidal ceria can generate a high quality surface in glass substrate CMP, but removal rate (RR) is smaller than that of calcined ceria. In order to improve the RR, KOH was added to the colloidal ceria. KOH additives make colloidal ceria particles aggregate and improve RR close to that of calcined ceria. By evaluating the extent of aggregation with and without ultrasonic dispersion, it was found there was a strong correlation with KOH concentration to aggregation strength and RR. To obtain further RR and to reduce the consumption of slurry, influence of polishing pressure and slurry concentration on polishing characteristics was investigated. As the polishing pressure increased, the RR improved, while slurry residue occurred partly on the edge of the substrate surface. The slurry residue was restrained by decreasing slurry concentration. Furthermore, although scratches in the nanometer order increase slightly under high polishing pressure, they are smaller than those by calcined ceria slurry. By controlling the degree of aggregation of colloidal ceria, we have achieved both high RR and high quality surface.

AB - Colloidal ceria is expected to be a candidate of alternative slurry for glass substrate CMP because the slurry particles are small and have a regular shape comparing to conventional calcined ceria particles. Thanks to the characteristics, the colloidal ceria can generate a high quality surface in glass substrate CMP, but removal rate (RR) is smaller than that of calcined ceria. In order to improve the RR, KOH was added to the colloidal ceria. KOH additives make colloidal ceria particles aggregate and improve RR close to that of calcined ceria. By evaluating the extent of aggregation with and without ultrasonic dispersion, it was found there was a strong correlation with KOH concentration to aggregation strength and RR. To obtain further RR and to reduce the consumption of slurry, influence of polishing pressure and slurry concentration on polishing characteristics was investigated. As the polishing pressure increased, the RR improved, while slurry residue occurred partly on the edge of the substrate surface. The slurry residue was restrained by decreasing slurry concentration. Furthermore, although scratches in the nanometer order increase slightly under high polishing pressure, they are smaller than those by calcined ceria slurry. By controlling the degree of aggregation of colloidal ceria, we have achieved both high RR and high quality surface.

UR - http://www.scopus.com/inward/record.url?scp=85072195755&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85072195755&partnerID=8YFLogxK

U2 - 10.1016/j.precisioneng.2019.06.014

DO - 10.1016/j.precisioneng.2019.06.014

M3 - Article

AN - SCOPUS:85072195755

VL - 60

SP - 458

EP - 464

JO - Precision Engineering

JF - Precision Engineering

SN - 0141-6359

ER -