Collapse Tests on 1/10-Scale Hull Girder Model of Chip Carrier in Sagging

Tetsuya Yao, Masahiko Fujikubo, Daisuke Yanagihara, Isshin Fujii

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In the present paperresults of buc kling collapse tests on 1/10-scale w elded steel hull girder models of a chip carrier in sagging are reported. Two models were pro vided, one with carlings at the top of the side shellplating and the other without carlings. It has been found that the buckling collapse of the deck plating as a stiffened plate together with local panel buckling at the top of side shell plating was the trigger of the overall collapse of the hull girder subjected to pure bending moment in sagging. Theoretical analysis was also performed applying the Smith's method. It was confirmed that the calculated and measured results show similar characteristics.

Original languageEnglish
Title of host publicationProceedings of the International Offshore and Polar Engineering Conference
Pages2626-2633
Number of pages8
Publication statusPublished - Dec 1 2003
Externally publishedYes
EventProceedings of the Thirteenth (2003) International Offshore and Polar Engineering Conference - Honolulu, HI, United States
Duration: May 25 2002May 30 2003

Other

OtherProceedings of the Thirteenth (2003) International Offshore and Polar Engineering Conference
CountryUnited States
CityHonolulu, HI
Period5/25/025/30/03

Fingerprint

Plating
Buckling
Bending moments
Steel

All Science Journal Classification (ASJC) codes

  • Ocean Engineering

Cite this

Yao, T., Fujikubo, M., Yanagihara, D., & Fujii, I. (2003). Collapse Tests on 1/10-Scale Hull Girder Model of Chip Carrier in Sagging. In Proceedings of the International Offshore and Polar Engineering Conference (pp. 2626-2633)

Collapse Tests on 1/10-Scale Hull Girder Model of Chip Carrier in Sagging. / Yao, Tetsuya; Fujikubo, Masahiko; Yanagihara, Daisuke; Fujii, Isshin.

Proceedings of the International Offshore and Polar Engineering Conference. 2003. p. 2626-2633.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Yao, T, Fujikubo, M, Yanagihara, D & Fujii, I 2003, Collapse Tests on 1/10-Scale Hull Girder Model of Chip Carrier in Sagging. in Proceedings of the International Offshore and Polar Engineering Conference. pp. 2626-2633, Proceedings of the Thirteenth (2003) International Offshore and Polar Engineering Conference, Honolulu, HI, United States, 5/25/02.
Yao T, Fujikubo M, Yanagihara D, Fujii I. Collapse Tests on 1/10-Scale Hull Girder Model of Chip Carrier in Sagging. In Proceedings of the International Offshore and Polar Engineering Conference. 2003. p. 2626-2633
Yao, Tetsuya ; Fujikubo, Masahiko ; Yanagihara, Daisuke ; Fujii, Isshin. / Collapse Tests on 1/10-Scale Hull Girder Model of Chip Carrier in Sagging. Proceedings of the International Offshore and Polar Engineering Conference. 2003. pp. 2626-2633
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