Combinatorial approach to evaluation of adhesion for epoxy resin/glass interface

Daisuke Kawaguchi, Martin Y M Chiang, Christopher M. Stafford

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A combinatorial approach to the edge delamination test was carried out to obtain the failure map of the epoxy/glass bond joint as a function of both temperature and film thickness. In the combinatorial test, a single specimen of an epoxy film bonded to a glass substrate with thickness gradient was subdivided into separate samples. By applying a temperature gradient orthogonal to the thickness gradient, a failure map was constructed in a single step. The bond failure was a cohesive fracture of glass. Based on the stress-temperature relationship of the epoxy/glass system, the fracture toughness of the glass is deduced from the failure map to be 0.91 MPa·m1/2, in line with the reported value of 0.80 MPa·m1/2. The results in this study clearly indicate that the combinatorial edge delamination test can be used to predict the reliability of bond joint as a function of film thickness and temperature and quantify the bond strength in a fast and accurate manner.

Original languageEnglish
Title of host publication54th SPSJ Annual Meeting 2005 - Polymer Preprints, Japan
Pages1920
Number of pages1
Volume54
Edition1
Publication statusPublished - 2005
Externally publishedYes
Event54th SPSJ Annual Meeting 2005 - Yokohama, Japan
Duration: May 25 2005May 27 2005

Other

Other54th SPSJ Annual Meeting 2005
CountryJapan
CityYokohama
Period5/25/055/27/05

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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