Combinatorial approach to evaluation of adhesion for epoxy resin/glass interface

Daisuke Kawaguchi; Martin Y M Chiang; Christopher M. Stafford

Combinatorial approach to evaluation of adhesion for epoxy resin/glass interface

Daisuke Kawaguchi, Martin Y M Chiang, Christopher M. Stafford

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

A combinatorial approach to the edge delamination test was carried out to obtain the failure map of the epoxy/glass bond joint as a function of both temperature and film thickness. In the combinatorial test, a single specimen of an epoxy film bonded to a glass substrate with thickness gradient was subdivided into separate samples. By applying a temperature gradient orthogonal to the thickness gradient, a failure map was constructed in a single step. The bond failure was a cohesive fracture of glass. Based on the stress-temperature relationship of the epoxy/glass system, the fracture toughness of the glass is deduced from the failure map to be 0.91 MPa·m^1/2, in line with the reported value of 0.80 MPa·m^1/2. The results in this study clearly indicate that the combinatorial edge delamination test can be used to predict the reliability of bond joint as a function of film thickness and temperature and quantify the bond strength in a fast and accurate manner.

Original language	English
Title of host publication	54th SPSJ Annual Meeting 2005 - Polymer Preprints, Japan
Pages	1920
Number of pages	1
Volume	54
Edition	1
Publication status	Published - 2005
Externally published	Yes
Event	54th SPSJ Annual Meeting 2005 - Yokohama, Japan Duration: May 25 2005 → May 27 2005

Other

Other	54th SPSJ Annual Meeting 2005
Country/Territory	Japan
City	Yokohama
Period	5/25/05 → 5/27/05

All Science Journal Classification (ASJC) codes

Engineering(all)

Cite this

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title = "Combinatorial approach to evaluation of adhesion for epoxy resin/glass interface",

abstract = "A combinatorial approach to the edge delamination test was carried out to obtain the failure map of the epoxy/glass bond joint as a function of both temperature and film thickness. In the combinatorial test, a single specimen of an epoxy film bonded to a glass substrate with thickness gradient was subdivided into separate samples. By applying a temperature gradient orthogonal to the thickness gradient, a failure map was constructed in a single step. The bond failure was a cohesive fracture of glass. Based on the stress-temperature relationship of the epoxy/glass system, the fracture toughness of the glass is deduced from the failure map to be 0.91 MPa·m1/2, in line with the reported value of 0.80 MPa·m1/2. The results in this study clearly indicate that the combinatorial edge delamination test can be used to predict the reliability of bond joint as a function of film thickness and temperature and quantify the bond strength in a fast and accurate manner.",

author = "Daisuke Kawaguchi and Chiang, {Martin Y M} and Stafford, {Christopher M.}",

year = "2005",

language = "English",

volume = "54",

pages = "1920",

booktitle = "54th SPSJ Annual Meeting 2005 - Polymer Preprints, Japan",

edition = "1",

note = "54th SPSJ Annual Meeting 2005 ; Conference date: 25-05-2005 Through 27-05-2005",

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TY - GEN

T1 - Combinatorial approach to evaluation of adhesion for epoxy resin/glass interface

AU - Kawaguchi, Daisuke

AU - Chiang, Martin Y M

AU - Stafford, Christopher M.

PY - 2005

Y1 - 2005

N2 - A combinatorial approach to the edge delamination test was carried out to obtain the failure map of the epoxy/glass bond joint as a function of both temperature and film thickness. In the combinatorial test, a single specimen of an epoxy film bonded to a glass substrate with thickness gradient was subdivided into separate samples. By applying a temperature gradient orthogonal to the thickness gradient, a failure map was constructed in a single step. The bond failure was a cohesive fracture of glass. Based on the stress-temperature relationship of the epoxy/glass system, the fracture toughness of the glass is deduced from the failure map to be 0.91 MPa·m1/2, in line with the reported value of 0.80 MPa·m1/2. The results in this study clearly indicate that the combinatorial edge delamination test can be used to predict the reliability of bond joint as a function of film thickness and temperature and quantify the bond strength in a fast and accurate manner.

AB - A combinatorial approach to the edge delamination test was carried out to obtain the failure map of the epoxy/glass bond joint as a function of both temperature and film thickness. In the combinatorial test, a single specimen of an epoxy film bonded to a glass substrate with thickness gradient was subdivided into separate samples. By applying a temperature gradient orthogonal to the thickness gradient, a failure map was constructed in a single step. The bond failure was a cohesive fracture of glass. Based on the stress-temperature relationship of the epoxy/glass system, the fracture toughness of the glass is deduced from the failure map to be 0.91 MPa·m1/2, in line with the reported value of 0.80 MPa·m1/2. The results in this study clearly indicate that the combinatorial edge delamination test can be used to predict the reliability of bond joint as a function of film thickness and temperature and quantify the bond strength in a fast and accurate manner.

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M3 - Conference contribution

AN - SCOPUS:33645644826

VL - 54

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BT - 54th SPSJ Annual Meeting 2005 - Polymer Preprints, Japan

T2 - 54th SPSJ Annual Meeting 2005

Y2 - 25 May 2005 through 27 May 2005

ER -

Combinatorial approach to evaluation of adhesion for epoxy resin/glass interface

Abstract

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