Compressive creep in an Al-3%Mg-0.2%Sc alloy processed by equal-channel angular pressing

Vaclav Sklenicka, Jiri Dvorak, Milan Svoboda, Petr Krai, Marie Kvapilova, Zenji Horita

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)


An Al-3wt.%Mg-0.2wt.%Sc alloy was subjected to equal-channel angular pressing (ECAP) through 8 passes via the processing route Bc to refine its grain size. Constant stress creep tests in compression were conducted at 473 K on ECAP billets and, for comparison purposes, on unpressed material. The present results were compared with the results of our earlier work on compressive creep of pure ECAP aluminium with the same imposed strain and the ECAP processing route. The results demonstrate that the creep strength of an Al-Mg-Sc alloy is significantly improved compared to that of pure aluminium. The higher strength observed for the pressed ternary alloy in the high-stress region (> 25 MPa) results from the synergism of solid-solution strengthening and precipitate strengthening due to Al3Sc nanoscale precipitates. The presence of these precipitates dramatically increases the creep resistance in the low-stress region through a threshold stress for creep. However, the creep resistance of the ECAP processed material was markedly deteriorated with respect to unpressed one.

Original languageEnglish
Title of host publicationUltrafine Grained Materials IV
Number of pages6
Publication statusPublished - May 22 2006
Event2006 TMS Annual Meeting - San Antonio, TX, United States
Duration: Mar 12 2006Mar 16 2006

Publication series

NameTMS Annual Meeting


Other2006 TMS Annual Meeting
CountryUnited States
CitySan Antonio, TX

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Mechanics of Materials
  • Metals and Alloys

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    Sklenicka, V., Dvorak, J., Svoboda, M., Krai, P., Kvapilova, M., & Horita, Z. (2006). Compressive creep in an Al-3%Mg-0.2%Sc alloy processed by equal-channel angular pressing. In Ultrafine Grained Materials IV (pp. 459-464). (TMS Annual Meeting; Vol. 2006).