Computer simulations of anodic dissolution in Cu-Au-Pd ternary alloys

Masaharu Nakagawa, T. Shiraishi, S. Matsuya, M. Ohta

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

Computer simulation experiments were performed for the anodic dissolution process of Cu0.7Au0.3-xPdx (x=0-0.3) alloys. Dissolution probabilities of constituents which represented the dissolution rate were defined by considering the standard electrode potential of the dissolution reaction and atomic interaction between Cu and the other atoms. The simulation results qualitatively reproduced the experimental results of anodic potentiostatic polarization tests regarding the dependence of the anodic dissolution behaviour on the polarization potential and the alloy composition, and the atomic concentration depth profile of the constituents after anodic polarization. Atomic interaction among the constituents of an alloy was found to be one of the important factors which control the anodic dissolution features of the alloys.

Original languageEnglish
Pages (from-to)1199-1204
Number of pages6
JournalJournal of Materials Science
Volume28
Issue number5
DOIs
Publication statusPublished - Mar 1993

Fingerprint

Ternary alloys
ternary alloys
dissolving
Dissolution
computerized simulation
Computer simulation
atomic interactions
Anodic polarization
polarization
Polarization
Atoms
Electrodes
electrodes
profiles
Chemical analysis
atoms
simulation
Experiments
interactions

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Electronic, Optical and Magnetic Materials
  • Materials Science(all)

Cite this

Computer simulations of anodic dissolution in Cu-Au-Pd ternary alloys. / Nakagawa, Masaharu; Shiraishi, T.; Matsuya, S.; Ohta, M.

In: Journal of Materials Science, Vol. 28, No. 5, 03.1993, p. 1199-1204.

Research output: Contribution to journalArticle

Nakagawa, Masaharu ; Shiraishi, T. ; Matsuya, S. ; Ohta, M. / Computer simulations of anodic dissolution in Cu-Au-Pd ternary alloys. In: Journal of Materials Science. 1993 ; Vol. 28, No. 5. pp. 1199-1204.
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