Conditioning of CMP pad to reinstate pad surface functions

Kazunori Kadomura, Toshio Fukunishi, Yoji Umezaki, Yoji Matsukawa, Syuhei Kurokawa, Toshiro K. Doi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

The role of the pad conditioning using two types of diamond pad conditioners in the CMP (chemical mechanical polishing) process has been investigated from the relationship between the pad surface conditions and polishing properties. During oxide-CMP, pad surface becomes clogged with the chips that are chemical reaction materials, causing the pad surfaces to degrade. Diamond conditioning serves to reinstate the pad surface providing it with necessary asperities.

Original languageEnglish
Title of host publicationICPT 2007 - International Conference on Planarization/CMP Technology, Proceedings
PublisherVDE Verlag GmbH
Pages449-453
Number of pages5
ISBN (Electronic)9783800730650
Publication statusPublished - 2007
Event2007 International Conference on Planarization/CMP Technology, ICPT 2007 - Dresden, Germany
Duration: Oct 25 2007Oct 27 2007

Publication series

NameICPT 2007 - International Conference on Planarization/CMP Technology, Proceedings

Conference

Conference2007 International Conference on Planarization/CMP Technology, ICPT 2007
Country/TerritoryGermany
CityDresden
Period10/25/0710/27/07

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Fingerprint

Dive into the research topics of 'Conditioning of CMP pad to reinstate pad surface functions'. Together they form a unique fingerprint.

Cite this