Control of Si solid-phase nucleation by surface steps for high performance thin film transistors

Tanemasa Asano, Kenji Makihira

Research output: Contribution to conferencePaperpeer-review

2 Citations (Scopus)

Abstract

Solid-phase nucleation process of amorphous Si(a-Si) at steps formed at SiO2 substrate surface has been investigated. Steps were formed by either isotropic or anisotropic wet chemical etching and a-Si films were deposited by vacuum evaporation. It has been found that nucleation sites can be controlled by changing the step shape and a-Si thickness. Grain growth up to about 3μm from the step edge has been observed, n-channel MOSFET's which had steps at the source/drain edge were fabricated. They showed effective electron mobility of about 200 cm2/V.s, which is approximately one order higher than that obtained from MOSFET's fabricated in Si films formed by the conventional solid phase crystallization.

Original languageEnglish
Pages29-31
Number of pages3
DOIs
Publication statusPublished - 1992
Externally publishedYes
EventExtended Abstracts of the 1992 International Conference on Solid State Devices and Materials - SSDM '92 - Tsukuba, Jpn
Duration: Aug 26 1992Aug 28 1992

Other

OtherExtended Abstracts of the 1992 International Conference on Solid State Devices and Materials - SSDM '92
CityTsukuba, Jpn
Period8/26/928/28/92

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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