Crack healing behavior of SiC whisker reinforced Si3N4 composite

Junfeng Hu, Shijie Zhu, Wenxue Wang, Yukiko Nakahara

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

In this paper, SiC whisker reinforced Si3N4 composite was used for studying crack healing behavior. Surface crack and straight-through crack were introduced on the tensile surface of specimens by Vickers hardness indenter based on the single edge pre-crack beam method. The cracked specimens were heat-treated at 1000 °C, 1100 °C, 1200 °C and 1300 °C for 1 hour in air. Bending strength was measured at room temperature by three point bending tests. It was investigated that the best heat treatment temperature of Si3N4/SiC whisker composite is 1200 °C -1300 °C. The relationship between bending strength and logarithm of crack area was linear and parabola in original and heat-treated specimens, respectively. Crack healing behavior was analyzed by oxidation filling model according to oxidation kinetics.

Original languageEnglish
Title of host publicationAdvanced Materials Science and Technology
Pages15-18
Number of pages4
DOIs
Publication statusPublished - Apr 10 2013
Event8th International Forum on Advanced Materials Science and Technology, IFAMST 2012 - Fukuoka City, Japan
Duration: Aug 1 2012Aug 4 2012

Publication series

NameMaterials Science Forum
Volume750
ISSN (Print)0255-5476

Other

Other8th International Forum on Advanced Materials Science and Technology, IFAMST 2012
CountryJapan
CityFukuoka City
Period8/1/128/4/12

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All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Hu, J., Zhu, S., Wang, W., & Nakahara, Y. (2013). Crack healing behavior of SiC whisker reinforced Si3N4 composite. In Advanced Materials Science and Technology (pp. 15-18). (Materials Science Forum; Vol. 750). https://doi.org/10.4028/www.scientific.net/MSF.750.15