TY - GEN
T1 - Crack healing behavior of SiC whisker reinforced Si3N4 composite
AU - Hu, Junfeng
AU - Zhu, Shijie
AU - Wang, Wenxue
AU - Nakahara, Yukiko
PY - 2013
Y1 - 2013
N2 - In this paper, SiC whisker reinforced Si3N4 composite was used for studying crack healing behavior. Surface crack and straight-through crack were introduced on the tensile surface of specimens by Vickers hardness indenter based on the single edge pre-crack beam method. The cracked specimens were heat-treated at 1000 °C, 1100 °C, 1200 °C and 1300 °C for 1 hour in air. Bending strength was measured at room temperature by three point bending tests. It was investigated that the best heat treatment temperature of Si3N4/SiC whisker composite is 1200 °C -1300 °C. The relationship between bending strength and logarithm of crack area was linear and parabola in original and heat-treated specimens, respectively. Crack healing behavior was analyzed by oxidation filling model according to oxidation kinetics.
AB - In this paper, SiC whisker reinforced Si3N4 composite was used for studying crack healing behavior. Surface crack and straight-through crack were introduced on the tensile surface of specimens by Vickers hardness indenter based on the single edge pre-crack beam method. The cracked specimens were heat-treated at 1000 °C, 1100 °C, 1200 °C and 1300 °C for 1 hour in air. Bending strength was measured at room temperature by three point bending tests. It was investigated that the best heat treatment temperature of Si3N4/SiC whisker composite is 1200 °C -1300 °C. The relationship between bending strength and logarithm of crack area was linear and parabola in original and heat-treated specimens, respectively. Crack healing behavior was analyzed by oxidation filling model according to oxidation kinetics.
UR - http://www.scopus.com/inward/record.url?scp=84875866794&partnerID=8YFLogxK
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U2 - 10.4028/www.scientific.net/MSF.750.15
DO - 10.4028/www.scientific.net/MSF.750.15
M3 - Conference contribution
AN - SCOPUS:84875866794
SN - 9783037856604
T3 - Materials Science Forum
SP - 15
EP - 18
BT - Advanced Materials Science and Technology
PB - Trans Tech Publications Ltd
T2 - 8th International Forum on Advanced Materials Science and Technology, IFAMST 2012
Y2 - 1 August 2012 through 4 August 2012
ER -