Crack healing behavior of SiC whisker reinforced Si3N4 composite

Junfeng Hu, Shijie Zhu, Wenxue Wang, Yukiko Nakahara

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

3 Citations (Scopus)

Abstract

In this paper, SiC whisker reinforced Si3N4 composite was used for studying crack healing behavior. Surface crack and straight-through crack were introduced on the tensile surface of specimens by Vickers hardness indenter based on the single edge pre-crack beam method. The cracked specimens were heat-treated at 1000 °C, 1100 °C, 1200 °C and 1300 °C for 1 hour in air. Bending strength was measured at room temperature by three point bending tests. It was investigated that the best heat treatment temperature of Si3N4/SiC whisker composite is 1200 °C -1300 °C. The relationship between bending strength and logarithm of crack area was linear and parabola in original and heat-treated specimens, respectively. Crack healing behavior was analyzed by oxidation filling model according to oxidation kinetics.

Original languageEnglish
Title of host publicationAdvanced Materials Science and Technology
PublisherTrans Tech Publications Ltd
Pages15-18
Number of pages4
ISBN (Print)9783037856604
DOIs
Publication statusPublished - 2013
Event8th International Forum on Advanced Materials Science and Technology, IFAMST 2012 - Fukuoka City, Japan
Duration: Aug 1 2012 → Aug 4 2012

Publication series

NameMaterials Science Forum
Volume750
ISSN (Print)0255-5476
ISSN (Electronic)1662-9752

Other

Other8th International Forum on Advanced Materials Science and Technology, IFAMST 2012
CountryJapan
CityFukuoka City
Period8/1/12 → 8/4/12

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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