Crack tip dislocations and its shielding effect

Masaki Tanaka, Yumi Hoshino, Alexander Hartmaier, Kenji Higashida

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Two dimensional simulations of discrete dislocation dynamics were carried out to clarify a shielding effect due to dislocations at a crack tip. The configuration of dislocations around the crack tip was calculated under the conditions of mode I tensile load at high temperatures. The stress field around the crack tip due to dislocations was found to be compressive, accommodating mode I stress intensity at the crack tip. In order to experimentally confirm the stress accommodation, infrared photoelastic observation was also performed in a specimen pre-deformed at high temperatures. The experimental result is in good agreement with a simulated infrared photoelastic image derived from the stress field calculated.

Original languageEnglish
Title of host publicationSelected, peer reviewed papers from The Sixth Pacific Rim International Conference on Advanced Materials and Processing, PRICM 6
Pages1833-1836
Number of pages4
EditionPART 3
Publication statusPublished - Dec 1 2007
Event6th Pacific Rim International Conference on Advanced Materials and Processing, PRICM 6 - Jeju, Korea, Republic of
Duration: Nov 5 2007Nov 9 2007

Publication series

NameMaterials Science Forum
NumberPART 3
Volume561-565
ISSN (Print)0255-5476

Other

Other6th Pacific Rim International Conference on Advanced Materials and Processing, PRICM 6
CountryKorea, Republic of
CityJeju
Period11/5/0711/9/07

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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  • Cite this

    Tanaka, M., Hoshino, Y., Hartmaier, A., & Higashida, K. (2007). Crack tip dislocations and its shielding effect. In Selected, peer reviewed papers from The Sixth Pacific Rim International Conference on Advanced Materials and Processing, PRICM 6 (PART 3 ed., pp. 1833-1836). (Materials Science Forum; Vol. 561-565, No. PART 3).