Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates

Kazuhiro Nogita, C. M. Gourlay, T. Nishimura

Research output: Contribution to journalArticle

101 Citations (Scopus)

Abstract

A method of limiting cracking in the Cu6Sn5 intermetallic compounds (IMCs) at the interface between lead-free solders and copper substrates has been developed. To explore the mechanism of crack inhibition in the nickel-containing IMC reaction layers, detailed synchrotron x-ray powder diffraction with Rietveld analysis and differential scanning calorimetry have been used. The results show that nickel stabilizes the high-temperature hexagonal allotrope of Cu6Sn5, avoiding stresses induced by a volumetric change that would otherwise occur on transformation to the monoclinic phase.

Original languageEnglish
Pages (from-to)45-51
Number of pages7
JournalJOM
Volume61
Issue number6
DOIs
Publication statusPublished - Oct 13 2009

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Engineering(all)

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