TY - JOUR
T1 - Creep and mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5 at elevated temperatures
AU - Mu, Dekui
AU - Huang, Han
AU - McDonald, Stuart D.
AU - Nogita, Kazuhiro
N1 - Funding Information:
We gratefully acknowledge financial support from the University of Queensland–Nihon Superior Co. Ltd. collaborative research program and support from an Australian Research Council Linkage Grant LP100200250. The authors would like to thank Dr Y.Q. Wu and Mr. J. Read from the University of Queensland for their contributions to this research. D. Mu would like to acknowledge the financial support in the form of an Australian Postgraduate Award (APA).
PY - 2013/2
Y1 - 2013/2
N2 - Cu6Sn5 is the most common and important intermetallic compound (IMC) formed between Sn-based solders and Cu substrates during soldering. The Cu6Sn5 IMC exhibits significantly different thermomechanical properties from the solder alloys and the substrate. The progress of high-density three-dimensional (3D) electrical packaging technologies has led to increased operating temperatures, and interfacial Cu6Sn5 accounts for a larger volume fraction of the fine-pitch solder joints in these packages. Knowledge of creep and the mechanical behavior of Cu6Sn5 at elevated temperatures is therefore essential to understanding the deformation of a lead-free solder joint in service. In this work, the effects of temperature and Ni solubility on creep and mechanical properties of Cu6Sn5 were investigated using energy-dispersive x-ray spectroscopy and nanoindentation. The reduced modulus and hardness of Cu6Sn5 were found to decrease as temperature increased from 25 C to 150 C. The addition of Ni increased the reduced modulus and hardness of Cu6Sn5 and had different effects on the creep of Cu6Sn5 at room and elevated temperatures.
AB - Cu6Sn5 is the most common and important intermetallic compound (IMC) formed between Sn-based solders and Cu substrates during soldering. The Cu6Sn5 IMC exhibits significantly different thermomechanical properties from the solder alloys and the substrate. The progress of high-density three-dimensional (3D) electrical packaging technologies has led to increased operating temperatures, and interfacial Cu6Sn5 accounts for a larger volume fraction of the fine-pitch solder joints in these packages. Knowledge of creep and the mechanical behavior of Cu6Sn5 at elevated temperatures is therefore essential to understanding the deformation of a lead-free solder joint in service. In this work, the effects of temperature and Ni solubility on creep and mechanical properties of Cu6Sn5 were investigated using energy-dispersive x-ray spectroscopy and nanoindentation. The reduced modulus and hardness of Cu6Sn5 were found to decrease as temperature increased from 25 C to 150 C. The addition of Ni increased the reduced modulus and hardness of Cu6Sn5 and had different effects on the creep of Cu6Sn5 at room and elevated temperatures.
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U2 - 10.1007/s11664-012-2227-y
DO - 10.1007/s11664-012-2227-y
M3 - Article
AN - SCOPUS:84878481504
SN - 0361-5235
VL - 42
SP - 304
EP - 311
JO - Journal of Electronic Materials
JF - Journal of Electronic Materials
IS - 2
ER -