Creep and mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5 at elevated temperatures

Dekui Mu, Han Huang, Stuart D. McDonald, Kazuhiro Nogita

Research output: Contribution to journalArticlepeer-review

21 Citations (Scopus)

Abstract

Cu6Sn5 is the most common and important intermetallic compound (IMC) formed between Sn-based solders and Cu substrates during soldering. The Cu6Sn5 IMC exhibits significantly different thermomechanical properties from the solder alloys and the substrate. The progress of high-density three-dimensional (3D) electrical packaging technologies has led to increased operating temperatures, and interfacial Cu6Sn5 accounts for a larger volume fraction of the fine-pitch solder joints in these packages. Knowledge of creep and the mechanical behavior of Cu6Sn5 at elevated temperatures is therefore essential to understanding the deformation of a lead-free solder joint in service. In this work, the effects of temperature and Ni solubility on creep and mechanical properties of Cu6Sn5 were investigated using energy-dispersive x-ray spectroscopy and nanoindentation. The reduced modulus and hardness of Cu6Sn5 were found to decrease as temperature increased from 25 C to 150 C. The addition of Ni increased the reduced modulus and hardness of Cu6Sn5 and had different effects on the creep of Cu6Sn5 at room and elevated temperatures.

Original languageEnglish
Pages (from-to)304-311
Number of pages8
JournalJournal of Electronic Materials
Volume42
Issue number2
DOIs
Publication statusPublished - Feb 2013

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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