Deep ultraviolet excimer laser processing for the micro via hole on semiconductor package

Physics

• Excimer Laser 100%
• Substrates 83%
• Glass 83%
• Semiconductor 50%
• Utilization 50%
• Laser Ablation 50%
• Value 33%
• Silicon 33%
• Alternatives 33%
• Defects 33%
• Quality 16%
• Cracks 16%
• Aspect Ratio 16%
• Transferring 16%
• Telecommunication 16%
• Micromachining 16%

Engineering

• Excimer Laser 100%
• Substrates 83%
• Applications 50%
• Defects 33%
• Ablation Process 33%
• Hard Material 33%
• Aspect Ratio 16%
• High Frequency 16%
• Glass Substrate 16%
• Production Process 16%
• Crack 16%
• Moore's Law 16%
• Frequency Signal 16%
• Silicon Substrate 16%
• Substrate Material 16%
• Laser Processing 16%
• Micro Machining 16%
• Fused Silica 16%
• Shorter Wavelength 16%
• 5G 16%
• High Photon Energy 16%
• Resolution Limit 16%
• Ablation Rate 16%
• Silica (Sio2) 16%

Medicine and Dentistry

• Silicon Dioxide 100%
• Glass 100%
• Laser Surgery 50%