Dehydration after plasma oxidation of porous low-dielectric-constant spin-on-glass films

Eiichi Kondoh, Tanemasa Asano, Hiroki Arao, Akira Nakashima, Michio Komatsu

Research output: Contribution to journalArticle

25 Citations (Scopus)

Abstract

In this paper, the dehydration behavior of hydrogen-methyl-siloxane-based porous spin-on-glass (SOG) films after oxygen plasma exposure is reported. The resultant loss of hydrophobia groups from the plasma exposure makes the films hygroscopic and thus the film dielectric constant can significantly increase. We employed a simple method consisting of spin-on coating of hexadimethyldisilazane (HMDS) with successive hotplate baking so as to dehydrate the films and decrease the film dielectric constant.

Original languageEnglish
Pages (from-to)3919-3923
Number of pages5
JournalJapanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
Volume39
Issue number7 A
DOIs
Publication statusPublished - Jan 1 2000

All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Physics and Astronomy(all)

Fingerprint Dive into the research topics of 'Dehydration after plasma oxidation of porous low-dielectric-constant spin-on-glass films'. Together they form a unique fingerprint.

  • Cite this