Dehydration after plasma oxidation of porous low-dielectric-constant spin-on-glass films

Eiichi Kondoh; Tanemasa Asano; Hiroki Arao; Akira Nakashima; Michio Komatsu

doi:10.1143/jjap.39.3919

Dehydration after plasma oxidation of porous low-dielectric-constant spin-on-glass films

Eiichi Kondoh, Tanemasa Asano, Hiroki Arao, Akira Nakashima, Michio Komatsu

Center for Japan-Egypt Cooperation in Science and Technology（E-JUST Center）

Research output: Contribution to journal › Article › peer-review

11 Citations (Scopus)

Abstract

In this paper, the dehydration behavior of hydrogen-methyl-siloxane-based porous spin-on-glass (SOG) films after oxygen plasma exposure is reported. The resultant loss of hydrophobia groups from the plasma exposure makes the films hygroscopic and thus the film dielectric constant can significantly increase. We employed a simple method consisting of spin-on coating of hexadimethyldisilazane (HMDS) with successive hotplate baking so as to dehydrate the films and decrease the film dielectric constant.

Original language	English
Pages (from-to)	3919-3923
Number of pages	5
Journal	Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
Volume	39
Issue number	7 A
DOIs	https://doi.org/10.1143/jjap.39.3919
Publication status	Published - Jan 1 2000

All Science Journal Classification (ASJC) codes

Engineering(all)
Physics and Astronomy(all)

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abstract = "In this paper, the dehydration behavior of hydrogen-methyl-siloxane-based porous spin-on-glass (SOG) films after oxygen plasma exposure is reported. The resultant loss of hydrophobia groups from the plasma exposure makes the films hygroscopic and thus the film dielectric constant can significantly increase. We employed a simple method consisting of spin-on coating of hexadimethyldisilazane (HMDS) with successive hotplate baking so as to dehydrate the films and decrease the film dielectric constant.",

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AU - Kondoh, Eiichi

AU - Asano, Tanemasa

AU - Arao, Hiroki

AU - Nakashima, Akira

AU - Komatsu, Michio

PY - 2000/1/1

Y1 - 2000/1/1

N2 - In this paper, the dehydration behavior of hydrogen-methyl-siloxane-based porous spin-on-glass (SOG) films after oxygen plasma exposure is reported. The resultant loss of hydrophobia groups from the plasma exposure makes the films hygroscopic and thus the film dielectric constant can significantly increase. We employed a simple method consisting of spin-on coating of hexadimethyldisilazane (HMDS) with successive hotplate baking so as to dehydrate the films and decrease the film dielectric constant.

AB - In this paper, the dehydration behavior of hydrogen-methyl-siloxane-based porous spin-on-glass (SOG) films after oxygen plasma exposure is reported. The resultant loss of hydrophobia groups from the plasma exposure makes the films hygroscopic and thus the film dielectric constant can significantly increase. We employed a simple method consisting of spin-on coating of hexadimethyldisilazane (HMDS) with successive hotplate baking so as to dehydrate the films and decrease the film dielectric constant.

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IS - 7 A

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Dehydration after plasma oxidation of porous low-dielectric-constant spin-on-glass films

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