Design and testing of a micro bubble-pumped heat pipe

Koji Takahashi, Kouichiro Yoshino, Tatsuya Ikuta, Kunihito Nagayama, Tanemasa Asano

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Micro thermal management devices using bubble in microchannel are under development. The heat removal mechanism of this device consists of phase change and forced convection which occur simultaneously and harmonically. Bubble expansion in horn-shaped microchannel gives directional pumping by low-energy consumption. Several kinds of chips are built and tested. The uncontrollable phenomena of bubbly flow in microchannels and the key factors for further improvement are discussed.

Original languageEnglish
Title of host publicationFluids Engineering
PublisherAmerican Society of Mechanical Engineers (ASME)
Pages465-468
Number of pages4
ISBN (Print)0791836576, 9780791836576
DOIs
Publication statusPublished - Jan 1 2002

Publication series

NameASME International Mechanical Engineering Congress and Exposition, Proceedings

All Science Journal Classification (ASJC) codes

  • Mechanical Engineering

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  • Cite this

    Takahashi, K., Yoshino, K., Ikuta, T., Nagayama, K., & Asano, T. (2002). Design and testing of a micro bubble-pumped heat pipe. In Fluids Engineering (pp. 465-468). (ASME International Mechanical Engineering Congress and Exposition, Proceedings). American Society of Mechanical Engineers (ASME). https://doi.org/10.1115/IMECE2002-33648