Design and testing of a micro bubble-pumped heat pipe

Koji Takahashi, Kouichiro Yoshino, Tatsuya Ikuta, Kunihito Nagayama, Tanemasa Asano

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Micro thermal management devices using bubble in microchannel are under development. The heat removal mechanism of this device consists of phase change and forced convection which occur simultaneously and harmonically. Bubble expansion in horn-shaped microchannel gives directional pumping by low-energy consumption. Several kinds of chips are built and tested. The uncontrollable phenomena of bubbly flow in microchannels and the key factors for further improvement are discussed.

Original languageEnglish
Title of host publicationFluids Engineering
PublisherAmerican Society of Mechanical Engineers (ASME)
Pages465-468
Number of pages4
ISBN (Print)0791836576, 9780791836576
DOIs
Publication statusPublished - Jan 1 2002

Publication series

NameASME International Mechanical Engineering Congress and Exposition, Proceedings

Fingerprint

Heat pipes
Microchannels
Testing
Forced convection
Energy utilization

All Science Journal Classification (ASJC) codes

  • Mechanical Engineering

Cite this

Takahashi, K., Yoshino, K., Ikuta, T., Nagayama, K., & Asano, T. (2002). Design and testing of a micro bubble-pumped heat pipe. In Fluids Engineering (pp. 465-468). (ASME International Mechanical Engineering Congress and Exposition, Proceedings). American Society of Mechanical Engineers (ASME). https://doi.org/10.1115/IMECE2002-33648

Design and testing of a micro bubble-pumped heat pipe. / Takahashi, Koji; Yoshino, Kouichiro; Ikuta, Tatsuya; Nagayama, Kunihito; Asano, Tanemasa.

Fluids Engineering. American Society of Mechanical Engineers (ASME), 2002. p. 465-468 (ASME International Mechanical Engineering Congress and Exposition, Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Takahashi, K, Yoshino, K, Ikuta, T, Nagayama, K & Asano, T 2002, Design and testing of a micro bubble-pumped heat pipe. in Fluids Engineering. ASME International Mechanical Engineering Congress and Exposition, Proceedings, American Society of Mechanical Engineers (ASME), pp. 465-468. https://doi.org/10.1115/IMECE2002-33648
Takahashi K, Yoshino K, Ikuta T, Nagayama K, Asano T. Design and testing of a micro bubble-pumped heat pipe. In Fluids Engineering. American Society of Mechanical Engineers (ASME). 2002. p. 465-468. (ASME International Mechanical Engineering Congress and Exposition, Proceedings). https://doi.org/10.1115/IMECE2002-33648
Takahashi, Koji ; Yoshino, Kouichiro ; Ikuta, Tatsuya ; Nagayama, Kunihito ; Asano, Tanemasa. / Design and testing of a micro bubble-pumped heat pipe. Fluids Engineering. American Society of Mechanical Engineers (ASME), 2002. pp. 465-468 (ASME International Mechanical Engineering Congress and Exposition, Proceedings).
@inproceedings{177bb83246cf473fb2db3a5c6497f228,
title = "Design and testing of a micro bubble-pumped heat pipe",
abstract = "Micro thermal management devices using bubble in microchannel are under development. The heat removal mechanism of this device consists of phase change and forced convection which occur simultaneously and harmonically. Bubble expansion in horn-shaped microchannel gives directional pumping by low-energy consumption. Several kinds of chips are built and tested. The uncontrollable phenomena of bubbly flow in microchannels and the key factors for further improvement are discussed.",
author = "Koji Takahashi and Kouichiro Yoshino and Tatsuya Ikuta and Kunihito Nagayama and Tanemasa Asano",
year = "2002",
month = "1",
day = "1",
doi = "10.1115/IMECE2002-33648",
language = "English",
isbn = "0791836576",
series = "ASME International Mechanical Engineering Congress and Exposition, Proceedings",
publisher = "American Society of Mechanical Engineers (ASME)",
pages = "465--468",
booktitle = "Fluids Engineering",

}

TY - GEN

T1 - Design and testing of a micro bubble-pumped heat pipe

AU - Takahashi, Koji

AU - Yoshino, Kouichiro

AU - Ikuta, Tatsuya

AU - Nagayama, Kunihito

AU - Asano, Tanemasa

PY - 2002/1/1

Y1 - 2002/1/1

N2 - Micro thermal management devices using bubble in microchannel are under development. The heat removal mechanism of this device consists of phase change and forced convection which occur simultaneously and harmonically. Bubble expansion in horn-shaped microchannel gives directional pumping by low-energy consumption. Several kinds of chips are built and tested. The uncontrollable phenomena of bubbly flow in microchannels and the key factors for further improvement are discussed.

AB - Micro thermal management devices using bubble in microchannel are under development. The heat removal mechanism of this device consists of phase change and forced convection which occur simultaneously and harmonically. Bubble expansion in horn-shaped microchannel gives directional pumping by low-energy consumption. Several kinds of chips are built and tested. The uncontrollable phenomena of bubbly flow in microchannels and the key factors for further improvement are discussed.

UR - http://www.scopus.com/inward/record.url?scp=78249282914&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=78249282914&partnerID=8YFLogxK

U2 - 10.1115/IMECE2002-33648

DO - 10.1115/IMECE2002-33648

M3 - Conference contribution

AN - SCOPUS:78249282914

SN - 0791836576

SN - 9780791836576

T3 - ASME International Mechanical Engineering Congress and Exposition, Proceedings

SP - 465

EP - 468

BT - Fluids Engineering

PB - American Society of Mechanical Engineers (ASME)

ER -