Design of electrostatic adhesion device using the flexible electrodes

Akifumi Takada; Shingo Nakamura; Yoko Yamanishi; Shinji Hashimura; Sumito Nagasawa; Takanobu Kogure; Shingo Maeda

doi:10.1109/MHS.2014.7006081

Design of electrostatic adhesion device using the flexible electrodes

Akifumi Takada, Shingo Nakamura, Yoko Yamanishi, Shinji Hashimura, Sumito Nagasawa, Takanobu Kogure, Shingo Maeda

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

This paper presents a fabrication method of electrostatic adhesion device using flexible electrodes. When an electric charge is stored in the bipolar plate of a capacitor, an electrostatic force acts. We perform adhesion to a wall surface using this electrostatic force. Using the electrostatic force, electrostatic adhesion force is controlled by the electricity. The flexible electrodes are created by spraying a solution containing dispersed carbon black onto a silicon rubber. Flexibility of the device can avoid damage to its own and adapt to a variety of wall surface shapes. In experiments, two kinds of device surface structures were created. One is just flat and the other is pillar arrays. The pillar arrays structure was adopted from the viewpoint of biomimetic. Electrostatic adhesion force of these structures was measured with shear and tensile testing machines.

Original language	English
Title of host publication	2014 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2014
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781479966790
DOIs	https://doi.org/10.1109/MHS.2014.7006081
Publication status	Published - Jan 9 2015
Externally published	Yes
Event	2014 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2014 - Nagoya, Japan Duration: Nov 10 2014 → Nov 12 2014

Publication series

Name	2014 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2014

Other

Other	2014 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2014
Country	Japan
City	Nagoya
Period	11/10/14 → 11/12/14

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering
Mechanical Engineering

Access to Document

10.1109/MHS.2014.7006081

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Cite this

Takada, A., Nakamura, S., Yamanishi, Y., Hashimura, S., Nagasawa, S., Kogure, T., & Maeda, S. (2015). Design of electrostatic adhesion device using the flexible electrodes. In 2014 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2014 [7006081] (2014 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2014). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MHS.2014.7006081

Design of electrostatic adhesion device using the flexible electrodes. / Takada, Akifumi; Nakamura, Shingo; Yamanishi, Yoko; Hashimura, Shinji; Nagasawa, Sumito; Kogure, Takanobu; Maeda, Shingo.

2014 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2014. Institute of Electrical and Electronics Engineers Inc., 2015. 7006081 (2014 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2014).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Takada, A, Nakamura, S, Yamanishi, Y, Hashimura, S, Nagasawa, S, Kogure, T & Maeda, S 2015, Design of electrostatic adhesion device using the flexible electrodes. in 2014 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2014., 7006081, 2014 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2014, Institute of Electrical and Electronics Engineers Inc., 2014 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2014, Nagoya, Japan, 11/10/14. https://doi.org/10.1109/MHS.2014.7006081

Takada A, Nakamura S, Yamanishi Y, Hashimura S, Nagasawa S, Kogure T et al. Design of electrostatic adhesion device using the flexible electrodes. In 2014 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2014. Institute of Electrical and Electronics Engineers Inc. 2015. 7006081. (2014 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2014). https://doi.org/10.1109/MHS.2014.7006081

Takada, Akifumi ; Nakamura, Shingo ; Yamanishi, Yoko ; Hashimura, Shinji ; Nagasawa, Sumito ; Kogure, Takanobu ; Maeda, Shingo. / Design of electrostatic adhesion device using the flexible electrodes. 2014 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2014. Institute of Electrical and Electronics Engineers Inc., 2015. (2014 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2014).

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