High third- order intercept output point (OIP3) RF amplifier, suitable for cheap semiconductor technology is proposed. The circuit functionality simulated using Agilent ADS and parasitic components were taken into account using Assura RCX chip design software. Chip has designed for TSMC 0.35-um BiCMOS process. An OIP3 over +30dBm was achieved with a gain of 8 dB, noise figure 5dB, and a power consumption 80 mW. Amplifier is intended to be used in receiver and transmitter paths of the 802.11a/b/n wireless LAN front-end in 5 GHz band.
|Title of host publication||2007 Asia-Pacific Microwave Conference, APMC|
|Publication status||Published - Dec 1 2007|
|Event||Asia-Pacific Microwave Conference, APMC 2007 - Bangkok, Thailand|
Duration: Dec 11 2007 → Dec 14 2007
|Other||Asia-Pacific Microwave Conference, APMC 2007|
|Period||12/11/07 → 12/14/07|
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