Determination of the minimum Ni concentration to prevent the η to η4+1 polymorphic transformation of stoichiometric Cu 6Sn5

Y. Q. Wu, S. D. McDonald, J. Read, H. Huang, Kazuhiro Nogita

Research output: Contribution to journalArticlepeer-review

24 Citations (Scopus)

Abstract

The minimum Ni concentration required to prevent the η to η4+1 polymorphic transformation of stoichiometric Cu 6Sn5 was found to be as low as 1 at.%. This is crucial in lead-free solder joints, especially in the ball grid array packages, in which only limited Ni can be supplied by micrometer-size solder balls. The Ni stabilization effect is present over a large temperature range with no phase transformation occurring between -120 and 250 °C for the timeframes used in this study.

Original languageEnglish
Pages (from-to)595-598
Number of pages4
JournalScripta Materialia
Volume68
Issue number8
DOIs
Publication statusPublished - Apr 1 2013

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics

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