Determination of the minimum Ni concentration to prevent the η to η4+1 polymorphic transformation of stoichiometric Cu 6Sn5

Y. Q. Wu, S. D. McDonald, J. Read, H. Huang, Kazuhiro Nogita

Research output: Contribution to journalArticle

19 Citations (Scopus)

Abstract

The minimum Ni concentration required to prevent the η to η4+1 polymorphic transformation of stoichiometric Cu 6Sn5 was found to be as low as 1 at.%. This is crucial in lead-free solder joints, especially in the ball grid array packages, in which only limited Ni can be supplied by micrometer-size solder balls. The Ni stabilization effect is present over a large temperature range with no phase transformation occurring between -120 and 250 °C for the timeframes used in this study.

Original languageEnglish
Pages (from-to)595-598
Number of pages4
JournalScripta Materialia
Volume68
Issue number8
DOIs
Publication statusPublished - Apr 1 2013

Fingerprint

Ball grid arrays
solders
Soldering alloys
balls
Stabilization
Phase transitions
phase transformations
micrometers
stabilization
grids
Temperature
temperature
Lead-free solders

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics

Cite this

Determination of the minimum Ni concentration to prevent the η to η4+1 polymorphic transformation of stoichiometric Cu 6Sn5 . / Wu, Y. Q.; McDonald, S. D.; Read, J.; Huang, H.; Nogita, Kazuhiro.

In: Scripta Materialia, Vol. 68, No. 8, 01.04.2013, p. 595-598.

Research output: Contribution to journalArticle

Wu, Y. Q. ; McDonald, S. D. ; Read, J. ; Huang, H. ; Nogita, Kazuhiro. / Determination of the minimum Ni concentration to prevent the η to η4+1 polymorphic transformation of stoichiometric Cu 6Sn5 In: Scripta Materialia. 2013 ; Vol. 68, No. 8. pp. 595-598.
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