Development and characterization of a flat laminate vapor chamber

Kei Mizuta; Rinkoh Fukunaga; Kenji Fukuda; Susumu Nii; Tanemasa Asano

doi:10.1016/j.applthermaleng.2016.05.080

Development and characterization of a flat laminate vapor chamber

Kei Mizuta, Rinkoh Fukunaga, Kenji Fukuda, Susumu Nii, Tanemasa Asano

Integrated Electronic Systems

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38 Citations (Scopus)

Abstract

Developed was a type of flat laminate vapor chamber called FGHP (Fine Grid Heat Pipe), and its thermal performance was investigated. Fine etching technique enabled formation of microstructures on laminate parts. The size of FGHP utilized in this study was 50 × 50 mm² and 2 mm thick. For reference, tested was a copper heat spreader having the same dimensions. Without regarding the heat input, the FGHP showed more uniform temperature distribution than the copper heat spreader. Even at a high heat flux, more than 2.0 MW m⁻², the FGHP had a thermal resistance as low as 0.08 K W⁻¹, which is about a quarter of that of the copper heat spreader. When thermal resistance of the FGHP was compared with various types of flat heat pipes or vapor chambers, it was the lowest among the all vapor chambers by taking the effect of area ratio into account.

Original language	English
Pages (from-to)	461-471
Number of pages	11
Journal	Applied Thermal Engineering
Volume	104
DOIs	https://doi.org/10.1016/j.applthermaleng.2016.05.080
Publication status	Published - Jul 5 2016

All Science Journal Classification (ASJC) codes

Energy Engineering and Power Technology
Industrial and Manufacturing Engineering

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10.1016/j.applthermaleng.2016.05.080

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title = "Development and characterization of a flat laminate vapor chamber",

abstract = "Developed was a type of flat laminate vapor chamber called FGHP (Fine Grid Heat Pipe), and its thermal performance was investigated. Fine etching technique enabled formation of microstructures on laminate parts. The size of FGHP utilized in this study was 50 × 50 mm2 and 2 mm thick. For reference, tested was a copper heat spreader having the same dimensions. Without regarding the heat input, the FGHP showed more uniform temperature distribution than the copper heat spreader. Even at a high heat flux, more than 2.0 MW m−2, the FGHP had a thermal resistance as low as 0.08 K W−1, which is about a quarter of that of the copper heat spreader. When thermal resistance of the FGHP was compared with various types of flat heat pipes or vapor chambers, it was the lowest among the all vapor chambers by taking the effect of area ratio into account.",

author = "Kei Mizuta and Rinkoh Fukunaga and Kenji Fukuda and Susumu Nii and Tanemasa Asano",

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T1 - Development and characterization of a flat laminate vapor chamber

AU - Mizuta, Kei

AU - Fukunaga, Rinkoh

AU - Fukuda, Kenji

AU - Nii, Susumu

AU - Asano, Tanemasa

PY - 2016/7/5

Y1 - 2016/7/5

N2 - Developed was a type of flat laminate vapor chamber called FGHP (Fine Grid Heat Pipe), and its thermal performance was investigated. Fine etching technique enabled formation of microstructures on laminate parts. The size of FGHP utilized in this study was 50 × 50 mm2 and 2 mm thick. For reference, tested was a copper heat spreader having the same dimensions. Without regarding the heat input, the FGHP showed more uniform temperature distribution than the copper heat spreader. Even at a high heat flux, more than 2.0 MW m−2, the FGHP had a thermal resistance as low as 0.08 K W−1, which is about a quarter of that of the copper heat spreader. When thermal resistance of the FGHP was compared with various types of flat heat pipes or vapor chambers, it was the lowest among the all vapor chambers by taking the effect of area ratio into account.

AB - Developed was a type of flat laminate vapor chamber called FGHP (Fine Grid Heat Pipe), and its thermal performance was investigated. Fine etching technique enabled formation of microstructures on laminate parts. The size of FGHP utilized in this study was 50 × 50 mm2 and 2 mm thick. For reference, tested was a copper heat spreader having the same dimensions. Without regarding the heat input, the FGHP showed more uniform temperature distribution than the copper heat spreader. Even at a high heat flux, more than 2.0 MW m−2, the FGHP had a thermal resistance as low as 0.08 K W−1, which is about a quarter of that of the copper heat spreader. When thermal resistance of the FGHP was compared with various types of flat heat pipes or vapor chambers, it was the lowest among the all vapor chambers by taking the effect of area ratio into account.

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Development and characterization of a flat laminate vapor chamber

Abstract

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