Development of a combinatorial plasma process analyzer for advanced R&D of next generation nanodevice fabrication

Kosuke Takenaka, Ken Cho, Yuichi Setsuhara, Masaharu Shiratani, Makoto Sekine, Masaru Hon

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

To develop a combinatorial plasma process analyzer in which the plasma distributions are finely controlled, we have carried out plasma-fluid simulations. The simulations show the feasibility of using low inductance antenna (LIA) modules to produce density-inclination plasmas. Numerically predicted plasma density profiles are generally in excellent agreement with experiments. A considerable inclination in plasma density was obtained using localized power deposition profiles. The results show that a variety of process results can be efficiently analyzed via the inclination distribution along the substrate for the process parameters.

Original languageEnglish
Title of host publicationCharacterization and Control of Interfaces for High Quality Advanced Materials III - Proc. 3rd Int. Conf. on Characterization and Control of Interfaces for High Quality Advanced Materials,ICCCI2009
Pages279-284
Number of pages6
Volume219
Publication statusPublished - 2010
Event3rd International Conference on Characterization and Control of Interfaces for High Quality Advanced Materials, ICCCI2009 - Kurashiki, Japan
Duration: Sep 6 2009Sep 9 2009

Publication series

NameCeramic Transactions
Volume219
ISSN (Print)10421122

Other

Other3rd International Conference on Characterization and Control of Interfaces for High Quality Advanced Materials, ICCCI2009
CountryJapan
CityKurashiki
Period9/6/099/9/09

    Fingerprint

All Science Journal Classification (ASJC) codes

  • Ceramics and Composites
  • Materials Chemistry

Cite this

Takenaka, K., Cho, K., Setsuhara, Y., Shiratani, M., Sekine, M., & Hon, M. (2010). Development of a combinatorial plasma process analyzer for advanced R&D of next generation nanodevice fabrication. In Characterization and Control of Interfaces for High Quality Advanced Materials III - Proc. 3rd Int. Conf. on Characterization and Control of Interfaces for High Quality Advanced Materials,ICCCI2009 (Vol. 219, pp. 279-284). (Ceramic Transactions; Vol. 219).