Development of a high efficiency polishing technology using abrasive control technique with AC electric field for glass substrates - Effect of an AC electric field on slurry behavior and polishing characteristics

Hiroshi Ikeda, Yoichi Akagami, Michio Uneda, Osamu Ohnishi, Syuhei Kurokawa, Toshiro K. Doi

Research output: Contribution to journalArticle

Abstract

This paper deals with the development of a novel polishing technique for the glass substrate for electric devices by applying AC electric field. In order to grasp the movements of the slurry under AC electric field, we have observed slurry behaviors with an observation device we developed, and found that the slurry was smoothly led to the polishing area by AC electric field. Furthermore, effectiveness of the slurry distribution on the polishing area increased by 12%. Polishing rate also increased 22% compared to the conventional polishing when AC electric field was applied. This will contribute to the reduction of the consumption of the cerium oxide abrasives.

Original languageEnglish
Pages (from-to)1146-1150
Number of pages5
JournalSeimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Volume77
Issue number12
DOIs
Publication statusPublished - Jan 1 2011

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Polishing
Abrasives
Electric fields
Glass
Substrates
Cerium
Oxides

All Science Journal Classification (ASJC) codes

  • Mechanical Engineering

Cite this

@article{18e7618e508c4cab966bc08019beb86b,
title = "Development of a high efficiency polishing technology using abrasive control technique with AC electric field for glass substrates - Effect of an AC electric field on slurry behavior and polishing characteristics",
abstract = "This paper deals with the development of a novel polishing technique for the glass substrate for electric devices by applying AC electric field. In order to grasp the movements of the slurry under AC electric field, we have observed slurry behaviors with an observation device we developed, and found that the slurry was smoothly led to the polishing area by AC electric field. Furthermore, effectiveness of the slurry distribution on the polishing area increased by 12{\%}. Polishing rate also increased 22{\%} compared to the conventional polishing when AC electric field was applied. This will contribute to the reduction of the consumption of the cerium oxide abrasives.",
author = "Hiroshi Ikeda and Yoichi Akagami and Michio Uneda and Osamu Ohnishi and Syuhei Kurokawa and Doi, {Toshiro K.}",
year = "2011",
month = "1",
day = "1",
doi = "10.2493/jjspe.77.1146",
language = "English",
volume = "77",
pages = "1146--1150",
journal = "Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering",
issn = "0912-0289",
publisher = "Japan Society for Precision Engineering",
number = "12",

}

TY - JOUR

T1 - Development of a high efficiency polishing technology using abrasive control technique with AC electric field for glass substrates - Effect of an AC electric field on slurry behavior and polishing characteristics

AU - Ikeda, Hiroshi

AU - Akagami, Yoichi

AU - Uneda, Michio

AU - Ohnishi, Osamu

AU - Kurokawa, Syuhei

AU - Doi, Toshiro K.

PY - 2011/1/1

Y1 - 2011/1/1

N2 - This paper deals with the development of a novel polishing technique for the glass substrate for electric devices by applying AC electric field. In order to grasp the movements of the slurry under AC electric field, we have observed slurry behaviors with an observation device we developed, and found that the slurry was smoothly led to the polishing area by AC electric field. Furthermore, effectiveness of the slurry distribution on the polishing area increased by 12%. Polishing rate also increased 22% compared to the conventional polishing when AC electric field was applied. This will contribute to the reduction of the consumption of the cerium oxide abrasives.

AB - This paper deals with the development of a novel polishing technique for the glass substrate for electric devices by applying AC electric field. In order to grasp the movements of the slurry under AC electric field, we have observed slurry behaviors with an observation device we developed, and found that the slurry was smoothly led to the polishing area by AC electric field. Furthermore, effectiveness of the slurry distribution on the polishing area increased by 12%. Polishing rate also increased 22% compared to the conventional polishing when AC electric field was applied. This will contribute to the reduction of the consumption of the cerium oxide abrasives.

UR - http://www.scopus.com/inward/record.url?scp=84555223669&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84555223669&partnerID=8YFLogxK

U2 - 10.2493/jjspe.77.1146

DO - 10.2493/jjspe.77.1146

M3 - Article

AN - SCOPUS:84555223669

VL - 77

SP - 1146

EP - 1150

JO - Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering

JF - Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering

SN - 0912-0289

IS - 12

ER -