Development of a wide-band compact diplexer using a redistribution layer for 5G application

Yuki Fujii, Hiroaki Nagano, Yuya Ishiguro, Teruo Horiguchi, Naoya Akita, Koichi Sakamoto, Haruichi Kanaya

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents a design of a wide-band compact diplexer using a redistribution layer (RDL) for 5G application. The proposed diplexer is combined a low pass filter (LPF) which has designed frequency at 4.1 GHz for n77 band and a high pass filter (HPF) which has designed frequency at 4.5 GHz. for n79 band. Moreover, spiral inductor is attached to enhance the band rejection characteristics. In the circuit simulation, input reflection coefficient (S11) is less than -10dB from 3.3 to 5.0 GHz. Insertion loss in low band (S21) is lower than -3dB ffom 3.3 to 4.1 GHz and that in high band (S31) is lower than -3dB from 4.5 to 5.0 GHz.

Original languageEnglish
Title of host publication2021 IEEE 23rd Electronics Packaging Technology Conference, EPTC 2021
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages339-342
Number of pages4
ISBN (Electronic)9781665416191
DOIs
Publication statusPublished - 2021
Event23rd IEEE Electronics Packaging Technology Conference, EPTC 2021 - Virtual, Online, Singapore
Duration: Dec 1 2021Dec 30 2021

Publication series

Name2021 IEEE 23rd Electronics Packaging Technology Conference, EPTC 2021

Conference

Conference23rd IEEE Electronics Packaging Technology Conference, EPTC 2021
Country/TerritorySingapore
CityVirtual, Online
Period12/1/2112/30/21

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality
  • Electronic, Optical and Magnetic Materials
  • Fluid Flow and Transfer Processes

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