Development of an AC electric field-applied tribochemical polishing technology to promote high-efficiency polishing for glass substrates (image analysis of dynamical slurry behaviours and polishing characteristics under AC electric field)

Hiroshi Ikeda, Yoichi Akagami, Michio Uneda, Osamu Ohnishi, Syuhei Kurokawa, Toshiro K. Doi

Research output: Contribution to journalArticle

Abstract

This paper deals with the investigation conducted on the mechanism of the polishing technology, to which AC electric field is applied. For the analysis of the slurry dynamical behaviors, we used a digital image processor. In this research, we have also worked to develop a novel high-efficiency polishing technology applying AC electric field for the glass substrates for IT devices. When AC electric field was applied to, the slurry behavior was found to have better stability than the one without AC electric field. Furthermore, good polishing rates were obtained under high-relative rotation speed between the glass substrates and polishing pad. This suggests that the friction heat generated between the glass substrate and polishing pad, which promote tribochemical reactions, improves polishing rate. This latest polishing technology makes the removal rate two times better than the conventional polishing and produces excellently smooth surface.

Original languageEnglish
Pages (from-to)986-995
Number of pages10
JournalNihon Kikai Gakkai Ronbunshu, C Hen/Transactions of the Japan Society of Mechanical Engineers, Part C
Volume78
Issue number787
DOIs
Publication statusPublished - Apr 16 2012

Fingerprint

Polishing
Image analysis
Electric fields
Glass
Substrates
Friction

All Science Journal Classification (ASJC) codes

  • Mechanics of Materials
  • Mechanical Engineering
  • Industrial and Manufacturing Engineering

Cite this

@article{905f6cad25b84ac7a8efdaa1294b8d3d,
title = "Development of an AC electric field-applied tribochemical polishing technology to promote high-efficiency polishing for glass substrates (image analysis of dynamical slurry behaviours and polishing characteristics under AC electric field)",
abstract = "This paper deals with the investigation conducted on the mechanism of the polishing technology, to which AC electric field is applied. For the analysis of the slurry dynamical behaviors, we used a digital image processor. In this research, we have also worked to develop a novel high-efficiency polishing technology applying AC electric field for the glass substrates for IT devices. When AC electric field was applied to, the slurry behavior was found to have better stability than the one without AC electric field. Furthermore, good polishing rates were obtained under high-relative rotation speed between the glass substrates and polishing pad. This suggests that the friction heat generated between the glass substrate and polishing pad, which promote tribochemical reactions, improves polishing rate. This latest polishing technology makes the removal rate two times better than the conventional polishing and produces excellently smooth surface.",
author = "Hiroshi Ikeda and Yoichi Akagami and Michio Uneda and Osamu Ohnishi and Syuhei Kurokawa and Doi, {Toshiro K.}",
year = "2012",
month = "4",
day = "16",
doi = "10.1299/kikaic.78.986",
language = "English",
volume = "78",
pages = "986--995",
journal = "Nippon Kikai Gakkai Ronbunshu, C Hen/Transactions of the Japan Society of Mechanical Engineers, Part C",
issn = "0387-5024",
publisher = "The Japan Society of Mechanical Engineers",
number = "787",

}

TY - JOUR

T1 - Development of an AC electric field-applied tribochemical polishing technology to promote high-efficiency polishing for glass substrates (image analysis of dynamical slurry behaviours and polishing characteristics under AC electric field)

AU - Ikeda, Hiroshi

AU - Akagami, Yoichi

AU - Uneda, Michio

AU - Ohnishi, Osamu

AU - Kurokawa, Syuhei

AU - Doi, Toshiro K.

PY - 2012/4/16

Y1 - 2012/4/16

N2 - This paper deals with the investigation conducted on the mechanism of the polishing technology, to which AC electric field is applied. For the analysis of the slurry dynamical behaviors, we used a digital image processor. In this research, we have also worked to develop a novel high-efficiency polishing technology applying AC electric field for the glass substrates for IT devices. When AC electric field was applied to, the slurry behavior was found to have better stability than the one without AC electric field. Furthermore, good polishing rates were obtained under high-relative rotation speed between the glass substrates and polishing pad. This suggests that the friction heat generated between the glass substrate and polishing pad, which promote tribochemical reactions, improves polishing rate. This latest polishing technology makes the removal rate two times better than the conventional polishing and produces excellently smooth surface.

AB - This paper deals with the investigation conducted on the mechanism of the polishing technology, to which AC electric field is applied. For the analysis of the slurry dynamical behaviors, we used a digital image processor. In this research, we have also worked to develop a novel high-efficiency polishing technology applying AC electric field for the glass substrates for IT devices. When AC electric field was applied to, the slurry behavior was found to have better stability than the one without AC electric field. Furthermore, good polishing rates were obtained under high-relative rotation speed between the glass substrates and polishing pad. This suggests that the friction heat generated between the glass substrate and polishing pad, which promote tribochemical reactions, improves polishing rate. This latest polishing technology makes the removal rate two times better than the conventional polishing and produces excellently smooth surface.

UR - http://www.scopus.com/inward/record.url?scp=84859621554&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84859621554&partnerID=8YFLogxK

U2 - 10.1299/kikaic.78.986

DO - 10.1299/kikaic.78.986

M3 - Article

AN - SCOPUS:84859621554

VL - 78

SP - 986

EP - 995

JO - Nippon Kikai Gakkai Ronbunshu, C Hen/Transactions of the Japan Society of Mechanical Engineers, Part C

JF - Nippon Kikai Gakkai Ronbunshu, C Hen/Transactions of the Japan Society of Mechanical Engineers, Part C

SN - 0387-5024

IS - 787

ER -