Development of basic-type CMP/P-CVM fusion processing system (Type A) and its fundamental characteristics

Kousuke Shiozawa, Yasuhisa Sano, Syuhei Kurokawa, Tadakazu Miyashita, Haruo Sumizawa, Toshiro Doi, Hideo Aida, Koki Oyama, Kazuto Yamauchi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

We propose a chemical mechanical polishing (CMP)/Plasma Chemical Vaporization Machining (P-CVM) fusion processing and developed basic type CMP/P-CVM fusion processing, which consists of mechanical polish part, P-CVM part, and sample holder moving between them. As a result of basic experiments using silicon carbide as a sample, it is found that Peak to valley of the surface profile can be reduced from 1500 nm to 200-300 nm by 40-times repetition of the mechanical polishing followed by P-CVM and the decrease rate of the height of the mesa structures by a CMP/P-CVM fusion processing is approximately 3.5 times larger than that of the mechanical polish.

Original languageEnglish
Title of host publicationICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages275-278
Number of pages4
ISBN (Electronic)9781479955565
DOIs
Publication statusPublished - Jan 20 2015
Event11th International Conference on Planarization/CMP Technology, ICPT 2014 - Kobe, Japan
Duration: Nov 19 2014Nov 21 2014

Publication series

NameICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014

Other

Other11th International Conference on Planarization/CMP Technology, ICPT 2014
CountryJapan
CityKobe
Period11/19/1411/21/14

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All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Hardware and Architecture

Cite this

Shiozawa, K., Sano, Y., Kurokawa, S., Miyashita, T., Sumizawa, H., Doi, T., ... Yamauchi, K. (2015). Development of basic-type CMP/P-CVM fusion processing system (Type A) and its fundamental characteristics. In ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014 (pp. 275-278). [7017298] (ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICPT.2014.7017298