Development of basic-type CMP/P-CVM fusion processing system (Type A) and its fundamental characteristics

Kousuke Shiozawa; Yasuhisa Sano; Syuhei Kurokawa; Tadakazu Miyashita; Haruo Sumizawa; Toshiro Doi; Hideo Aida; Koki Oyama; Kazuto Yamauchi

doi:10.1109/ICPT.2014.7017298

Development of basic-type CMP/P-CVM fusion processing system (Type A) and its fundamental characteristics

Kousuke Shiozawa, Yasuhisa Sano, Syuhei Kurokawa, Tadakazu Miyashita, Haruo Sumizawa, Toshiro Doi, Hideo Aida, Koki Oyama, Kazuto Yamauchi

Manufacturing Process

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

We propose a chemical mechanical polishing (CMP)/Plasma Chemical Vaporization Machining (P-CVM) fusion processing and developed basic type CMP/P-CVM fusion processing, which consists of mechanical polish part, P-CVM part, and sample holder moving between them. As a result of basic experiments using silicon carbide as a sample, it is found that Peak to valley of the surface profile can be reduced from 1500 nm to 200-300 nm by 40-times repetition of the mechanical polishing followed by P-CVM and the decrease rate of the height of the mesa structures by a CMP/P-CVM fusion processing is approximately 3.5 times larger than that of the mechanical polish.

Original language	English
Title of host publication	ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	275-278
Number of pages	4
ISBN (Electronic)	9781479955565
DOIs	https://doi.org/10.1109/ICPT.2014.7017298
Publication status	Published - Jan 20 2015
Event	11th International Conference on Planarization/CMP Technology, ICPT 2014 - Kobe, Japan Duration: Nov 19 2014 → Nov 21 2014

Publication series

Name	ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014

Other

Other	11th International Conference on Planarization/CMP Technology, ICPT 2014
Country/Territory	Japan
City	Kobe
Period	11/19/14 → 11/21/14

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering
Hardware and Architecture

Access to Document

10.1109/ICPT.2014.7017298

Cite this

Shiozawa, K., Sano, Y., Kurokawa, S., Miyashita, T., Sumizawa, H., Doi, T., Aida, H., Oyama, K., & Yamauchi, K. (2015). Development of basic-type CMP/P-CVM fusion processing system (Type A) and its fundamental characteristics. In ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014 (pp. 275-278). [7017298] (ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICPT.2014.7017298

Development of basic-type CMP/P-CVM fusion processing system (Type A) and its fundamental characteristics. / Shiozawa, Kousuke; Sano, Yasuhisa; Kurokawa, Syuhei et al.

ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014. Institute of Electrical and Electronics Engineers Inc., 2015. p. 275-278 7017298 (ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Shiozawa, K, Sano, Y, Kurokawa, S, Miyashita, T, Sumizawa, H, Doi, T, Aida, H, Oyama, K & Yamauchi, K 2015, Development of basic-type CMP/P-CVM fusion processing system (Type A) and its fundamental characteristics. in ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014., 7017298, ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014, Institute of Electrical and Electronics Engineers Inc., pp. 275-278, 11th International Conference on Planarization/CMP Technology, ICPT 2014, Kobe, Japan, 11/19/14. https://doi.org/10.1109/ICPT.2014.7017298

Shiozawa K, Sano Y, Kurokawa S, Miyashita T, Sumizawa H, Doi T et al. Development of basic-type CMP/P-CVM fusion processing system (Type A) and its fundamental characteristics. In ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014. Institute of Electrical and Electronics Engineers Inc. 2015. p. 275-278. 7017298. (ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014). doi: 10.1109/ICPT.2014.7017298

Shiozawa, Kousuke ; Sano, Yasuhisa ; Kurokawa, Syuhei et al. / Development of basic-type CMP/P-CVM fusion processing system (Type A) and its fundamental characteristics. ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014. Institute of Electrical and Electronics Engineers Inc., 2015. pp. 275-278 (ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014).

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AU - Kurokawa, Syuhei

AU - Miyashita, Tadakazu

AU - Sumizawa, Haruo

AU - Doi, Toshiro

AU - Aida, Hideo

AU - Oyama, Koki

AU - Yamauchi, Kazuto

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AB - We propose a chemical mechanical polishing (CMP)/Plasma Chemical Vaporization Machining (P-CVM) fusion processing and developed basic type CMP/P-CVM fusion processing, which consists of mechanical polish part, P-CVM part, and sample holder moving between them. As a result of basic experiments using silicon carbide as a sample, it is found that Peak to valley of the surface profile can be reduced from 1500 nm to 200-300 nm by 40-times repetition of the mechanical polishing followed by P-CVM and the decrease rate of the height of the mesa structures by a CMP/P-CVM fusion processing is approximately 3.5 times larger than that of the mechanical polish.

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Development of basic-type CMP/P-CVM fusion processing system (Type A) and its fundamental characteristics

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