Development of cooling system for a large area at high heat flux by using flow boiling in narrow channels

Shinichi Miura, Yukihiro Inada, Shinmoto Yasuhisa, Haruhiko Ohta

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Advance of an electronic technology has caused the increase of heat generation density for semiconductors densely integrated. Thermal management becomes more important, and a cooling system for high heat flux is required. It is extremely effective to such a demand using flow boiling heat transfer because of its high heat removal ability. To develop the cooling system for a large area at high heat flux, the cold plate structure of narrow channels with auxiliary unheated channel for additional liquid supply was devised and confirmed its validity by experiments. A large surface of 150mm in heated length and 30mm in width with grooves of an apex angle of 90 deg, 0.5mm depth and 1mm in pitch was employed. A structure of narrow rectangular heated channel between parallel plates with an unheated auxiliary channel was employed and the heat transfer characteristics were examined by using water for different combinations of gap sizes and volumetric flow rates. Five different liquid distribution modes were tested and their data were compared. The values of CHF larger than 1.9×106W/m2 for gap size of 2mm under mass velocity based on total volumetric flow rate and on the cross section area of main heated channel 720kg/m2s or 1.7×106W/m2 for gap size of 5mm under 290kg/m2s were obtained under total volumetric flow rate 4.5×10-5m3/s regardless of the liquid distribution modes. Under several conditions, the extensions of dry-patches were observed at the upstream location of the main heated channel resulting burnout not at the downstream but at the upstream. High values of CHF larger than 2×106W/m2 were obtained only for gap size of 2mm. The result indicates that higher mass velocity in the main heated channel is more effective for the increase in CHF. It was clarified that there is optimum flow rate distribution to obtain the highest values of CHF. For gap size of 2mm, high heat transfer coefficient as much as 7.4×104W/m 2K were obtained at heat flux 1.5×106W/m2 under mass velocity 720kg/m2s based on total volumetric flow rate and on the cross section area of main heated channel. Also to obtain high heat transfer coefficient, it is more useful to supply the cooling liquid from the auxiliary unheated channel for additional liquid supply in the transverse direction perpendicular to the flow in the main heated channel.

Original languageEnglish
Title of host publicationProceedings of the 7th International Conference on Nanochannels, Microchannels, and Minichannels 2009, ICNMM2009
Pages287-294
Number of pages8
EditionPART A
DOIs
Publication statusPublished - Dec 1 2009
Event7th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM2009 - Pohang, Korea, Republic of
Duration: Jun 22 2009Jun 24 2009

Publication series

NameProceedings of the 7th International Conference on Nanochannels, Microchannels, and Minichannels 2009, ICNMM2009
NumberPART A

Other

Other7th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM2009
CountryKorea, Republic of
CityPohang
Period6/22/096/24/09

Fingerprint

Cooling systems
Boiling liquids
Heat flux
Flow rate
Liquids
Heat transfer coefficients
Heat transfer
Heat generation
Temperature control
Semiconductor materials
Cooling
Water
Experiments

All Science Journal Classification (ASJC) codes

  • Fluid Flow and Transfer Processes
  • Mechanical Engineering

Cite this

Miura, S., Inada, Y., Yasuhisa, S., & Ohta, H. (2009). Development of cooling system for a large area at high heat flux by using flow boiling in narrow channels. In Proceedings of the 7th International Conference on Nanochannels, Microchannels, and Minichannels 2009, ICNMM2009 (PART A ed., pp. 287-294). (Proceedings of the 7th International Conference on Nanochannels, Microchannels, and Minichannels 2009, ICNMM2009; No. PART A). https://doi.org/10.1115/ICNMM2009-82279

Development of cooling system for a large area at high heat flux by using flow boiling in narrow channels. / Miura, Shinichi; Inada, Yukihiro; Yasuhisa, Shinmoto; Ohta, Haruhiko.

Proceedings of the 7th International Conference on Nanochannels, Microchannels, and Minichannels 2009, ICNMM2009. PART A. ed. 2009. p. 287-294 (Proceedings of the 7th International Conference on Nanochannels, Microchannels, and Minichannels 2009, ICNMM2009; No. PART A).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Miura, S, Inada, Y, Yasuhisa, S & Ohta, H 2009, Development of cooling system for a large area at high heat flux by using flow boiling in narrow channels. in Proceedings of the 7th International Conference on Nanochannels, Microchannels, and Minichannels 2009, ICNMM2009. PART A edn, Proceedings of the 7th International Conference on Nanochannels, Microchannels, and Minichannels 2009, ICNMM2009, no. PART A, pp. 287-294, 7th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM2009, Pohang, Korea, Republic of, 6/22/09. https://doi.org/10.1115/ICNMM2009-82279
Miura S, Inada Y, Yasuhisa S, Ohta H. Development of cooling system for a large area at high heat flux by using flow boiling in narrow channels. In Proceedings of the 7th International Conference on Nanochannels, Microchannels, and Minichannels 2009, ICNMM2009. PART A ed. 2009. p. 287-294. (Proceedings of the 7th International Conference on Nanochannels, Microchannels, and Minichannels 2009, ICNMM2009; PART A). https://doi.org/10.1115/ICNMM2009-82279
Miura, Shinichi ; Inada, Yukihiro ; Yasuhisa, Shinmoto ; Ohta, Haruhiko. / Development of cooling system for a large area at high heat flux by using flow boiling in narrow channels. Proceedings of the 7th International Conference on Nanochannels, Microchannels, and Minichannels 2009, ICNMM2009. PART A. ed. 2009. pp. 287-294 (Proceedings of the 7th International Conference on Nanochannels, Microchannels, and Minichannels 2009, ICNMM2009; PART A).
@inproceedings{2b43e35a7ea44288a805fee7b10ce190,
title = "Development of cooling system for a large area at high heat flux by using flow boiling in narrow channels",
abstract = "Advance of an electronic technology has caused the increase of heat generation density for semiconductors densely integrated. Thermal management becomes more important, and a cooling system for high heat flux is required. It is extremely effective to such a demand using flow boiling heat transfer because of its high heat removal ability. To develop the cooling system for a large area at high heat flux, the cold plate structure of narrow channels with auxiliary unheated channel for additional liquid supply was devised and confirmed its validity by experiments. A large surface of 150mm in heated length and 30mm in width with grooves of an apex angle of 90 deg, 0.5mm depth and 1mm in pitch was employed. A structure of narrow rectangular heated channel between parallel plates with an unheated auxiliary channel was employed and the heat transfer characteristics were examined by using water for different combinations of gap sizes and volumetric flow rates. Five different liquid distribution modes were tested and their data were compared. The values of CHF larger than 1.9×106W/m2 for gap size of 2mm under mass velocity based on total volumetric flow rate and on the cross section area of main heated channel 720kg/m2s or 1.7×106W/m2 for gap size of 5mm under 290kg/m2s were obtained under total volumetric flow rate 4.5×10-5m3/s regardless of the liquid distribution modes. Under several conditions, the extensions of dry-patches were observed at the upstream location of the main heated channel resulting burnout not at the downstream but at the upstream. High values of CHF larger than 2×106W/m2 were obtained only for gap size of 2mm. The result indicates that higher mass velocity in the main heated channel is more effective for the increase in CHF. It was clarified that there is optimum flow rate distribution to obtain the highest values of CHF. For gap size of 2mm, high heat transfer coefficient as much as 7.4×104W/m 2K were obtained at heat flux 1.5×106W/m2 under mass velocity 720kg/m2s based on total volumetric flow rate and on the cross section area of main heated channel. Also to obtain high heat transfer coefficient, it is more useful to supply the cooling liquid from the auxiliary unheated channel for additional liquid supply in the transverse direction perpendicular to the flow in the main heated channel.",
author = "Shinichi Miura and Yukihiro Inada and Shinmoto Yasuhisa and Haruhiko Ohta",
year = "2009",
month = "12",
day = "1",
doi = "10.1115/ICNMM2009-82279",
language = "English",
isbn = "9780791843499",
series = "Proceedings of the 7th International Conference on Nanochannels, Microchannels, and Minichannels 2009, ICNMM2009",
number = "PART A",
pages = "287--294",
booktitle = "Proceedings of the 7th International Conference on Nanochannels, Microchannels, and Minichannels 2009, ICNMM2009",
edition = "PART A",

}

TY - GEN

T1 - Development of cooling system for a large area at high heat flux by using flow boiling in narrow channels

AU - Miura, Shinichi

AU - Inada, Yukihiro

AU - Yasuhisa, Shinmoto

AU - Ohta, Haruhiko

PY - 2009/12/1

Y1 - 2009/12/1

N2 - Advance of an electronic technology has caused the increase of heat generation density for semiconductors densely integrated. Thermal management becomes more important, and a cooling system for high heat flux is required. It is extremely effective to such a demand using flow boiling heat transfer because of its high heat removal ability. To develop the cooling system for a large area at high heat flux, the cold plate structure of narrow channels with auxiliary unheated channel for additional liquid supply was devised and confirmed its validity by experiments. A large surface of 150mm in heated length and 30mm in width with grooves of an apex angle of 90 deg, 0.5mm depth and 1mm in pitch was employed. A structure of narrow rectangular heated channel between parallel plates with an unheated auxiliary channel was employed and the heat transfer characteristics were examined by using water for different combinations of gap sizes and volumetric flow rates. Five different liquid distribution modes were tested and their data were compared. The values of CHF larger than 1.9×106W/m2 for gap size of 2mm under mass velocity based on total volumetric flow rate and on the cross section area of main heated channel 720kg/m2s or 1.7×106W/m2 for gap size of 5mm under 290kg/m2s were obtained under total volumetric flow rate 4.5×10-5m3/s regardless of the liquid distribution modes. Under several conditions, the extensions of dry-patches were observed at the upstream location of the main heated channel resulting burnout not at the downstream but at the upstream. High values of CHF larger than 2×106W/m2 were obtained only for gap size of 2mm. The result indicates that higher mass velocity in the main heated channel is more effective for the increase in CHF. It was clarified that there is optimum flow rate distribution to obtain the highest values of CHF. For gap size of 2mm, high heat transfer coefficient as much as 7.4×104W/m 2K were obtained at heat flux 1.5×106W/m2 under mass velocity 720kg/m2s based on total volumetric flow rate and on the cross section area of main heated channel. Also to obtain high heat transfer coefficient, it is more useful to supply the cooling liquid from the auxiliary unheated channel for additional liquid supply in the transverse direction perpendicular to the flow in the main heated channel.

AB - Advance of an electronic technology has caused the increase of heat generation density for semiconductors densely integrated. Thermal management becomes more important, and a cooling system for high heat flux is required. It is extremely effective to such a demand using flow boiling heat transfer because of its high heat removal ability. To develop the cooling system for a large area at high heat flux, the cold plate structure of narrow channels with auxiliary unheated channel for additional liquid supply was devised and confirmed its validity by experiments. A large surface of 150mm in heated length and 30mm in width with grooves of an apex angle of 90 deg, 0.5mm depth and 1mm in pitch was employed. A structure of narrow rectangular heated channel between parallel plates with an unheated auxiliary channel was employed and the heat transfer characteristics were examined by using water for different combinations of gap sizes and volumetric flow rates. Five different liquid distribution modes were tested and their data were compared. The values of CHF larger than 1.9×106W/m2 for gap size of 2mm under mass velocity based on total volumetric flow rate and on the cross section area of main heated channel 720kg/m2s or 1.7×106W/m2 for gap size of 5mm under 290kg/m2s were obtained under total volumetric flow rate 4.5×10-5m3/s regardless of the liquid distribution modes. Under several conditions, the extensions of dry-patches were observed at the upstream location of the main heated channel resulting burnout not at the downstream but at the upstream. High values of CHF larger than 2×106W/m2 were obtained only for gap size of 2mm. The result indicates that higher mass velocity in the main heated channel is more effective for the increase in CHF. It was clarified that there is optimum flow rate distribution to obtain the highest values of CHF. For gap size of 2mm, high heat transfer coefficient as much as 7.4×104W/m 2K were obtained at heat flux 1.5×106W/m2 under mass velocity 720kg/m2s based on total volumetric flow rate and on the cross section area of main heated channel. Also to obtain high heat transfer coefficient, it is more useful to supply the cooling liquid from the auxiliary unheated channel for additional liquid supply in the transverse direction perpendicular to the flow in the main heated channel.

UR - http://www.scopus.com/inward/record.url?scp=77952904540&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=77952904540&partnerID=8YFLogxK

U2 - 10.1115/ICNMM2009-82279

DO - 10.1115/ICNMM2009-82279

M3 - Conference contribution

AN - SCOPUS:77952904540

SN - 9780791843499

T3 - Proceedings of the 7th International Conference on Nanochannels, Microchannels, and Minichannels 2009, ICNMM2009

SP - 287

EP - 294

BT - Proceedings of the 7th International Conference on Nanochannels, Microchannels, and Minichannels 2009, ICNMM2009

ER -