Development of highly efficient 5GHz-band CMOS class-E power amplifier module

Kyohei Eto, Kizuku Takemoto, Haruichi Kanaya

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This paper presents the development of a high-efficient class-E power amplifier (PA) module for 5-GHz wireless transmitter applications using constant envelope modulation scheme in a 0.18-μm CMOS technology. This PA was placed on the lead frame and molded in the packaging for transmitter application. In our design, bonding wires are optimized by using electro-magnetic simulation. And the coplanar waveguide structure was composed of bonding wires at the RF port. Furthermore, in order to reduce the chip size and metal loss, spiral inductors were replaced by bonding wire on chip. We fabricated this PA module and measured saturated output power and maximum power-added-efficiency (PAE) at 5 GHz-band. The measured saturated output power is 17.6 dBm at 5.2GHz.

Original languageEnglish
Title of host publication2015 IEEE 17th Electronics Packaging and Technology Conference, EPTC 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781467372688
DOIs
Publication statusPublished - Feb 17 2016
Event17th IEEE Electronics Packaging and Technology Conference, EPTC 2015 - Singapore, Singapore
Duration: Dec 2 2015Dec 4 2015

Publication series

NameProceedings of the Electronic Packaging Technology Conference, EPTC
Volume2016-February

Other

Other17th IEEE Electronics Packaging and Technology Conference, EPTC 2015
CountrySingapore
CitySingapore
Period12/2/1512/4/15

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All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

Cite this

Eto, K., Takemoto, K., & Kanaya, H. (2016). Development of highly efficient 5GHz-band CMOS class-E power amplifier module. In 2015 IEEE 17th Electronics Packaging and Technology Conference, EPTC 2015 [7412318] (Proceedings of the Electronic Packaging Technology Conference, EPTC; Vol. 2016-February). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPTC.2015.7412318