Development of UHF to 2.4GHz and 5.2GHz dual band up-conversion CMOS mixer

Ryoya Miyamoto, A. I.A. Galal, Haruichi Kanaya

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents the development of an up conversion mixer for wireless transmitter application in a 0.18-μm CMOS technology. The designed up-conversion mixer input center frequency is 620MHz and the output is 2.4GHz and 5.2GHz, respectively, for white space of TV broadcast frequency (470∼710MHz) communication system. In this design, it is become available by constructing dual band filter using bonding wires and chip inductors. The mixer is designed using TSMC 0.18μm CMOS process. Circuit simulations and measurements had been performed. The proposed mixer has a simulated conversion gain of 15.5dB and 16.2dB, IIP3 of -3.35dBm and -1.76dBm, noise figure of 5.32dB and 5.32dB at 2.4GHz and 5.2GHz.

Original languageEnglish
Title of host publicationProceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages199-202
Number of pages4
ISBN (Electronic)9781509043682
DOIs
Publication statusPublished - Feb 21 2017
Event18th IEEE Electronics Packaging Technology Conference, EPTC 2016 - Singapore, Singapore
Duration: Nov 30 2016Dec 3 2016

Publication series

NameProceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016

Other

Other18th IEEE Electronics Packaging Technology Conference, EPTC 2016
CountrySingapore
CitySingapore
Period11/30/1612/3/16

Fingerprint

Mixer circuits
Circuit simulation
Noise figure
Transmitters
Communication systems
Wire

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Ceramics and Composites
  • Electronic, Optical and Magnetic Materials
  • Metals and Alloys

Cite this

Miyamoto, R., Galal, A. I. A., & Kanaya, H. (2017). Development of UHF to 2.4GHz and 5.2GHz dual band up-conversion CMOS mixer. In Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016 (pp. 199-202). [7861471] (Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPTC.2016.7861471

Development of UHF to 2.4GHz and 5.2GHz dual band up-conversion CMOS mixer. / Miyamoto, Ryoya; Galal, A. I.A.; Kanaya, Haruichi.

Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016. Institute of Electrical and Electronics Engineers Inc., 2017. p. 199-202 7861471 (Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Miyamoto, R, Galal, AIA & Kanaya, H 2017, Development of UHF to 2.4GHz and 5.2GHz dual band up-conversion CMOS mixer. in Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016., 7861471, Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016, Institute of Electrical and Electronics Engineers Inc., pp. 199-202, 18th IEEE Electronics Packaging Technology Conference, EPTC 2016, Singapore, Singapore, 11/30/16. https://doi.org/10.1109/EPTC.2016.7861471
Miyamoto R, Galal AIA, Kanaya H. Development of UHF to 2.4GHz and 5.2GHz dual band up-conversion CMOS mixer. In Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016. Institute of Electrical and Electronics Engineers Inc. 2017. p. 199-202. 7861471. (Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016). https://doi.org/10.1109/EPTC.2016.7861471
Miyamoto, Ryoya ; Galal, A. I.A. ; Kanaya, Haruichi. / Development of UHF to 2.4GHz and 5.2GHz dual band up-conversion CMOS mixer. Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016. Institute of Electrical and Electronics Engineers Inc., 2017. pp. 199-202 (Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016).
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