TY - JOUR
T1 - Dimension change during multi-step imprint process and in-plain compression
AU - Miyata, Tsuyoshi
AU - Tokumaru, Kazuki
AU - Tsumori, Fujio
N1 - Funding Information:
This research is supported by Adaptable and Seamless Technology transfer Program through Target-driven R&D (A-STEP) from Japan Science and Technology Agency (JST). The research is also financially supported by the Mitsui Foundation for the Advancement of Tool and Die Technology.
Publisher Copyright:
© 2020 SPST.
PY - 2020
Y1 - 2020
N2 - In nature, there are living organisms that have functional properties with a special surface structure. The research has been widely conducted to apply the same functional properties by engineering the above structure. In this study, we focused on the hierarchical structure with high aspect ratio found in lotus leaves and Morpho butterfly scales. We chose Nano imprint lithography (NIL) as a method for fabricating the structures because of its advantages such as low cost and high accuracy. However, the conventional NIL only enables to transfer patterns perpendicular to work surface due to the necessity of mold release, so that we cannot obtain a hierarchical structure by NIL. Therefore, as a new process, we tried to form a hierarchical pattern by multi-step imprinting and to increase the aspect ratio by an in-plane compression method. In this paper, we quantitatively evaluated the interface pattern of each hierarchy.
AB - In nature, there are living organisms that have functional properties with a special surface structure. The research has been widely conducted to apply the same functional properties by engineering the above structure. In this study, we focused on the hierarchical structure with high aspect ratio found in lotus leaves and Morpho butterfly scales. We chose Nano imprint lithography (NIL) as a method for fabricating the structures because of its advantages such as low cost and high accuracy. However, the conventional NIL only enables to transfer patterns perpendicular to work surface due to the necessity of mold release, so that we cannot obtain a hierarchical structure by NIL. Therefore, as a new process, we tried to form a hierarchical pattern by multi-step imprinting and to increase the aspect ratio by an in-plane compression method. In this paper, we quantitatively evaluated the interface pattern of each hierarchy.
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U2 - 10.2494/photopolymer.33.199
DO - 10.2494/photopolymer.33.199
M3 - Article
AN - SCOPUS:85087350293
VL - 33
SP - 199
EP - 204
JO - Journal of Photopolymer Science and Technology
JF - Journal of Photopolymer Science and Technology
SN - 0914-9244
IS - 2
ER -