Direct connection of LSI chips to polyethylene naphthalate using Au cone bump

Takanori Shuto, Naoya Watanabe, Akihiro Ikeda, Takao Higashimachi, Tanemasa Asano

Research output: Contribution to conferencePaper

Abstract

We show that the direct connection of LSI chip to PEN (polyethylene naphthalate) film can be realized by using Au cone bump for flexible display. More than 10,000 connections at 20 μm pitch with low resistance can be realized at 150 °C.

Original languageEnglish
Pages1717-1720
Number of pages4
Publication statusPublished - Dec 1 2010
Event17th International Display Workshops, IDW'10 - Fukuoka, Japan
Duration: Dec 1 2010Dec 3 2010

Other

Other17th International Display Workshops, IDW'10
CountryJapan
CityFukuoka
Period12/1/1012/3/10

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All Science Journal Classification (ASJC) codes

  • Computer Vision and Pattern Recognition
  • Human-Computer Interaction

Cite this

Shuto, T., Watanabe, N., Ikeda, A., Higashimachi, T., & Asano, T. (2010). Direct connection of LSI chips to polyethylene naphthalate using Au cone bump. 1717-1720. Paper presented at 17th International Display Workshops, IDW'10, Fukuoka, Japan.