Direct connection of LSI chips to polyethylene naphthalate using Au cone bump

Takanori Shuto; Naoya Watanabe; Akihiro Ikeda; Takao Higashimachi; Tanemasa Asano

Direct connection of LSI chips to polyethylene naphthalate using Au cone bump

Takanori Shuto, Naoya Watanabe, Akihiro Ikeda, Takao Higashimachi, Tanemasa Asano

Integrated Electronic Systems

Research output: Contribution to conference › Paper › peer-review

Abstract

We show that the direct connection of LSI chip to PEN (polyethylene naphthalate) film can be realized by using Au cone bump for flexible display. More than 10,000 connections at 20 μm pitch with low resistance can be realized at 150 °C.

Original language	English
Pages	1717-1720
Number of pages	4
Publication status	Published - Dec 1 2010
Event	17th International Display Workshops, IDW'10 - Fukuoka, Japan Duration: Dec 1 2010 → Dec 3 2010

Other

Other	17th International Display Workshops, IDW'10
Country/Territory	Japan
City	Fukuoka
Period	12/1/10 → 12/3/10

All Science Journal Classification (ASJC) codes

Computer Vision and Pattern Recognition
Human-Computer Interaction

Cite this

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title = "Direct connection of LSI chips to polyethylene naphthalate using Au cone bump",

abstract = "We show that the direct connection of LSI chip to PEN (polyethylene naphthalate) film can be realized by using Au cone bump for flexible display. More than 10,000 connections at 20 μm pitch with low resistance can be realized at 150 °C.",

author = "Takanori Shuto and Naoya Watanabe and Akihiro Ikeda and Takao Higashimachi and Tanemasa Asano",

year = "2010",

month = dec,

day = "1",

language = "English",

pages = "1717--1720",

note = "17th International Display Workshops, IDW'10 ; Conference date: 01-12-2010 Through 03-12-2010",

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TY - CONF

T1 - Direct connection of LSI chips to polyethylene naphthalate using Au cone bump

AU - Shuto, Takanori

AU - Watanabe, Naoya

AU - Ikeda, Akihiro

AU - Higashimachi, Takao

AU - Asano, Tanemasa

PY - 2010/12/1

Y1 - 2010/12/1

N2 - We show that the direct connection of LSI chip to PEN (polyethylene naphthalate) film can be realized by using Au cone bump for flexible display. More than 10,000 connections at 20 μm pitch with low resistance can be realized at 150 °C.

AB - We show that the direct connection of LSI chip to PEN (polyethylene naphthalate) film can be realized by using Au cone bump for flexible display. More than 10,000 connections at 20 μm pitch with low resistance can be realized at 150 °C.

UR - http://www.scopus.com/inward/record.url?scp=79956314390&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=79956314390&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:79956314390

SP - 1717

EP - 1720

T2 - 17th International Display Workshops, IDW'10

Y2 - 1 December 2010 through 3 December 2010

ER -

Direct connection of LSI chips to polyethylene naphthalate using Au cone bump

Abstract

Other

All Science Journal Classification (ASJC) codes

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