Direct photo emission motion observation of current filaments in the IGBT under avalanche breakdown condition

Koichi Endo, Shinji Nagamine, Wataru Saito, Tomoko Matsudai, Tsuneo Ogura, Takashi Setoya, Koji Nakamae

Research output: Chapter in Book/Report/Conference proceedingConference contribution

13 Citations (Scopus)

Abstract

Many recent studies have been reported that the current distribution has non-uniformity in IGBT under Unclamped inductive switching (UIS) condition. Those discussions are based on the calculation result performed using device simulators. And, the observation of thermal action of device has been reported by using the IR thermography. The non-uniform temperature distribution on chip and thermal map change at every several micro second periods. In this study, time resolved emission (TRE) microscopy was used to get highly precise data. The probability distribution of current in the IGBT under UIS condition was observed. Also, a change of current distribution dependent on the time and motion of current concentration were detected. These areas of high current density existence probability move along termination region of device 1.75μs after avalanche breakdown with damping. This is the first study to show the direct motion observation of photon emission from the current fllamentation in IGBT under avalanche breakdown condition.

Original languageEnglish
Title of host publicationProceedings of the 2016 28th International Symposium on Power Semiconductor Devices and ICs, ISPSD 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages367-370
Number of pages4
ISBN (Electronic)9781467387682
DOIs
Publication statusPublished - Jul 25 2016
Externally publishedYes
Event28th International Symposium on Power Semiconductor Devices and ICs, ISPSD 2016 - Prague, Czech Republic
Duration: Jun 12 2016Jun 16 2016

Publication series

NameProceedings of the International Symposium on Power Semiconductor Devices and ICs
Volume2016-July
ISSN (Print)1063-6854

Conference

Conference28th International Symposium on Power Semiconductor Devices and ICs, ISPSD 2016
Country/TerritoryCzech Republic
CityPrague
Period6/12/166/16/16

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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