TY - GEN
T1 - Dominant Timing Direct Identification for Radiation Noise due to Extended Double Pulse Test on Bare SiC MOSFET and Si RC-IGBT Chips
AU - Tadakuma, Toshiya
AU - Nishi, Koichi
AU - Rogers, Michael
AU - Shoyama, Masahito
N1 - Publisher Copyright:
© 2020 IEEE.
PY - 2020/7
Y1 - 2020/7
N2 - This paper describes a practical methodology to identify dominant switching timing directly with current dependency relative to radiation noise in switching power devices. Using an expanded double pulse test method on a half bridge circuit, it is possible to measure radiation noise as a switching characteristic the same as loss, time or switching speed. As a result, it is possible for power device makers to adjust in device development stage without building a total system. The methodology is introduced with results of power chips with different properties, SiC MOSFET and Si RC-IGBT. In future work, the results will be utilized to optimize not only the basic system but also power device structures.
AB - This paper describes a practical methodology to identify dominant switching timing directly with current dependency relative to radiation noise in switching power devices. Using an expanded double pulse test method on a half bridge circuit, it is possible to measure radiation noise as a switching characteristic the same as loss, time or switching speed. As a result, it is possible for power device makers to adjust in device development stage without building a total system. The methodology is introduced with results of power chips with different properties, SiC MOSFET and Si RC-IGBT. In future work, the results will be utilized to optimize not only the basic system but also power device structures.
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U2 - 10.1109/EMCSI38923.2020.9191602
DO - 10.1109/EMCSI38923.2020.9191602
M3 - Conference contribution
AN - SCOPUS:85091857303
T3 - 2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020
SP - 73
EP - 78
BT - 2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020
Y2 - 28 July 2020 through 28 August 2020
ER -