Durability of Mechanical Damage Gettering Effect in Si Wafers

Renshi Sawada

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

This paper reports an investigation of the durability of the mechanical damage gettering effect in Si wafers through a 3-step thermal treatment consisting of an 8-hour annealing step between two oxidation steps. The gettering durability in Si wafers with scribe damage on the back surface and with straight dislocations introduced in the neutral plane was examined in relation to the macroscopic strain field, which appears as wafer warpage, and the microscopic strain field, which is present in the vicinity of damage, even after the macroscopic strain was reduced by thermal treatment. When the scribe damage was deep, good durability was obtained, and there was no difference between the gettering effects during the first and second oxidation steps. The macroscopic strain gradient had little effect in promoting gettering. The extent of the gettered range was found to be dominated mainly by microscopic strain and to depend upon the morphology of dislocations.

Original languageEnglish
Pages (from-to)959-964
Number of pages6
JournalJapanese Journal of Applied Physics
Volume23
Issue number8 R
DOIs
Publication statusPublished - Jan 1 1984

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durability
Durability
wafers
damage
warpage
oxidation
Heat treatment
Oxidation
gradients
annealing
Annealing

All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Physics and Astronomy(all)

Cite this

Durability of Mechanical Damage Gettering Effect in Si Wafers. / Sawada, Renshi.

In: Japanese Journal of Applied Physics, Vol. 23, No. 8 R, 01.01.1984, p. 959-964.

Research output: Contribution to journalArticle

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