Dynamic observation of dislocation movement across twin boundaries in the lamellar structure of TiAl intermetallic compound

T. Hanamura, Ryuji Uemori, M. Tanino, H. Morikawa

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

Mechanisms of enhancement of plastic deformation in TiAl responsible for ductility improvement of this material, have been studied by high-voltage electron microscopy (HVEM) and atom probe field ion microscopy (AP-FIM). During cross-twinning, a dislocation interaction occurs at twin boundaries. Dislocation networks and fine Ti3Al particles on the pre-existing twin boundaries promote the formation and movement of twinning partial dislocations, contributing to an improvement of ductility.

Original languageEnglish
Pages (from-to)86-91
Number of pages6
JournalUltramicroscopy
Volume39
Issue number1-4
DOIs
Publication statusPublished - Nov 2 1991
Externally publishedYes

Fingerprint

Lamellar structures
Twinning
Dislocations (crystals)
Intermetallics
intermetallics
Ductility
twinning
ductility
Electron microscopy
Plastic deformation
Microscopic examination
Ions
Atoms
plastic deformation
high voltages
electron microscopy
Electric potential
microscopy
augmentation
probes

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Instrumentation

Cite this

Dynamic observation of dislocation movement across twin boundaries in the lamellar structure of TiAl intermetallic compound. / Hanamura, T.; Uemori, Ryuji; Tanino, M.; Morikawa, H.

In: Ultramicroscopy, Vol. 39, No. 1-4, 02.11.1991, p. 86-91.

Research output: Contribution to journalArticle

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