Dynamic Strain of Ultrasonic Cu and Au Ball Bonding Measured In-Situ by Using Silicon Piezoresistive Sensor

Keiichiro Iwanabe, Kenichi Nakadozono, Mamoru Sakamoto, Tanemasa Asano

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

Dynamic changes in distribution of mechanical strain generated during wire bonding in Si under and near the bonding pad were measured by using a piezoresistive linear array sensor. The sensor was designed to be able to determine strains in the directions normal and parallel to the surface. Bonding dynamics of Cu and Au balls were investigated. We can clearly observe the oscillating strain according to the application of 150 kHz ultrasonic vibration. It was also clearly observed that the position of the largest compressive strain moved from the center of the ball to the periphery according to the progress of bonding under the application of the ultrasonic vibration. Bonding of Cu was found to generate larger strain than bonding of Au. A large oscillating tensile strain generated at the periphery of Cu ball when ultrasonic amplitude is increased is found to cause fracture of Si. The largest residual strain is observed for Cu bonding at the location where the end of capillary tool was present during bonding.

Original languageEnglish
Title of host publicationProceedings - IEEE 67th Electronic Components and Technology Conference, ECTC 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1786-1792
Number of pages7
ISBN (Electronic)9781509043323
DOIs
Publication statusPublished - Aug 1 2017
Event67th IEEE Electronic Components and Technology Conference, ECTC 2017 - Lake Buena Vista, United States
Duration: May 30 2017Jun 2 2017

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Other

Other67th IEEE Electronic Components and Technology Conference, ECTC 2017
CountryUnited States
CityLake Buena Vista
Period5/30/176/2/17

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Dynamic Strain of Ultrasonic Cu and Au Ball Bonding Measured In-Situ by Using Silicon Piezoresistive Sensor'. Together they form a unique fingerprint.

Cite this