Effect of argon/hydrogen plasma cleaning on electroless ni deposition on small-area al pads

Akihiro Ikeda, Kouhei Kajiwara, Naoya Watanabe, Tanemasa Asano

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7 Citations (Scopus)

Abstract

We investigated effect of Ar/H2 plasma cleaning on electroless Ni under-bump metallurgy (UBM) layer formation on small-area Al pads. When 5 × 5 μm2 pads are cleaned with the plasma, electroless Ni grows successfully on them, whereas no growth occurs on pads cleaned with conventional wet chemicals. In the Ni-UBM layer formation process, Zn is deposited by displacement plating on the Al pads before the electroless Ni plating. Microscopic observations, however, reveal that Zn is not successfully deposited on the wet-cleaned Al-pad surface. X-ray chemical analysis indicates that the plasma cleaning effectively removes C contaminations even for small pad sizes.

Original languageEnglish
Article number08JA05
JournalJapanese journal of applied physics
Volume49
Issue number8 PART 2
DOIs
Publication statusPublished - Aug 2010

All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Physics and Astronomy(all)

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