Effect of Bi or Sb addition on high temperature deformation behavior in Sn-Cu-Ni solder alloys

Masayuki Takano, Keiji Kuroda, Kohei Hase, Shuuto Tanaka, Shigeto Yamasaki, Masatoshi Mitsuhara, Hideharu Nakashima

Research output: Contribution to journalArticle

Abstract

Global concerns over the environmental impact and health effects of the lead-based solders have led to the development of lead-free solder alloys. Further improvements in the reliability of lead-free solder alloys at high temperatures are required for downsizing of electronic components in vehicles. In this work, tensile and creep tests and microstructure analysis were carried out to determine the effect of Bi or Sb addition on high-temperature deformation behavior in Sn-Cu-Ni solder alloys. The addition of Bi or Sb increased the strength of the Sn-Cu-Ni solder alloys. The stress exponent was estimated to be ≥3, indicating that the high- Temperature deformation was controlled by dislocation creep. Furthermore, in both the alloys, the stress exponent observed in the low stress region was nearly equal to 3 and discontinuously increased to ≥7 in the high stress region. For Sb addition, the solute atmosphere drag mechanism was observed in the low stress region.

Original languageEnglish
Pages (from-to)502-509
Number of pages8
JournalNippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Volume81
Issue number11
DOIs
Publication statusPublished - Sep 25 2017

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Mechanics of Materials
  • Metals and Alloys
  • Materials Chemistry

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