Effect of Bi or Sb addition on high temperature deformation behavior in Sn-Cu-Ni solder alloys

Masayuki Takano, Keiji Kuroda, Kohei Hase, Shuuto Tanaka, Shigeto Yamasaki, Masatoshi Mitsuhara, Hideharu Nakashima

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Physics & Astronomy

Engineering & Materials Science

Chemical Compounds