Effect of coating self-assembled monolayer on room-temperature bonding of Cu micro-interconnects

Lijing Qiu, Akihiro Ikeda, Tanemasa Asano

Research output: Contribution to journalReview article

3 Citations (Scopus)

Abstract

The effect of coating the surface of a Cu microbump with a 1-hexanethiol self-assembled monolayer (SAM) on room-temperature solid-phase bonding was investigated. The microbump was cone-shaped while the counterelectrode was planar. Room-temperature bonding was performed by applying ultrasonic vibration. Chemical analysis showed that the SAM coating suppressed the surface oxidation of Cu. However, it was shown that the SAM coating also reduced the mechanical strength of the bonded interface, whereas little effect was observed in the electrical resistance of bump interconnects.

Original languageEnglish
Article number068004
JournalJapanese journal of applied physics
Volume52
Issue number6 PART 1
DOIs
Publication statusPublished - Jun 1 2013

Fingerprint

Self assembled monolayers
coatings
Coatings
room temperature
Acoustic impedance
electrical resistance
chemical analysis
Temperature
Vibrations (mechanical)
Strength of materials
solid phases
Cones
cones
ultrasonics
Ultrasonics
vibration
Oxidation
oxidation
Chemical analysis

All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Physics and Astronomy(all)

Cite this

Effect of coating self-assembled monolayer on room-temperature bonding of Cu micro-interconnects. / Qiu, Lijing; Ikeda, Akihiro; Asano, Tanemasa.

In: Japanese journal of applied physics, Vol. 52, No. 6 PART 1, 068004, 01.06.2013.

Research output: Contribution to journalReview article

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