Effect of Coating Self-Assembled Monolayer on Room-Temperature Bonding of Cu Micro-Interconnects

Lising Qiu, Akihiro Ikeda, Tanemasa Asano

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)068004-1-3
JournalJapanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
Volume52
Issue number6
Publication statusPublished - Jun 2013

Cite this

Effect of Coating Self-Assembled Monolayer on Room-Temperature Bonding of Cu Micro-Interconnects. / Qiu, Lising; Ikeda, Akihiro; Asano, Tanemasa.

In: Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes, Vol. 52, No. 6, 06.2013, p. 068004-1-3.

Research output: Contribution to journalArticle

@article{a0ecef6086e5448e8f3ab80561db1fcc,
title = "Effect of Coating Self-Assembled Monolayer on Room-Temperature Bonding of Cu Micro-Interconnects",
author = "Lising Qiu and Akihiro Ikeda and Tanemasa Asano",
year = "2013",
month = "6",
language = "English",
volume = "52",
pages = "068004--1--3",
journal = "Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes",
issn = "0021-4922",
publisher = "Institute of Physics",
number = "6",

}

TY - JOUR

T1 - Effect of Coating Self-Assembled Monolayer on Room-Temperature Bonding of Cu Micro-Interconnects

AU - Qiu, Lising

AU - Ikeda, Akihiro

AU - Asano, Tanemasa

PY - 2013/6

Y1 - 2013/6

M3 - Article

VL - 52

SP - 068004-1-3

JO - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

JF - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

SN - 0021-4922

IS - 6

ER -