Effect of cooling rate on the intermetallic layer in solder joints

Keith Sweatman, Tetsuro Nishimura, Stuart D. McDonald, Kazuhiro Nogita

Research output: Contribution to journalArticle

Abstract

In this paper the authors report a study of the effect of cooling rates on Cu 6Sn 5 crystals. Cooling rates from 200°C ranged from 10°C/minute to 100°C/minute and the effect of isothermal ageing at intermediate temperatures was also studied. The extent of the phase transformation after each regime was determined using synchrotron X-ray diffraction.

Original languageEnglish
Pages (from-to)68-77
Number of pages10
JournalSMT Surface Mount Technology Magazine
Volume27
Issue number11
Publication statusPublished - Nov 2012
Externally publishedYes

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Soldering alloys
Intermetallics
Cooling
Synchrotrons
Aging of materials
Phase transitions
X ray diffraction
Crystals
Temperature

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Cite this

Sweatman, K., Nishimura, T., McDonald, S. D., & Nogita, K. (2012). Effect of cooling rate on the intermetallic layer in solder joints. SMT Surface Mount Technology Magazine, 27(11), 68-77.

Effect of cooling rate on the intermetallic layer in solder joints. / Sweatman, Keith; Nishimura, Tetsuro; McDonald, Stuart D.; Nogita, Kazuhiro.

In: SMT Surface Mount Technology Magazine, Vol. 27, No. 11, 11.2012, p. 68-77.

Research output: Contribution to journalArticle

Sweatman, K, Nishimura, T, McDonald, SD & Nogita, K 2012, 'Effect of cooling rate on the intermetallic layer in solder joints', SMT Surface Mount Technology Magazine, vol. 27, no. 11, pp. 68-77.
Sweatman K, Nishimura T, McDonald SD, Nogita K. Effect of cooling rate on the intermetallic layer in solder joints. SMT Surface Mount Technology Magazine. 2012 Nov;27(11):68-77.
Sweatman, Keith ; Nishimura, Tetsuro ; McDonald, Stuart D. ; Nogita, Kazuhiro. / Effect of cooling rate on the intermetallic layer in solder joints. In: SMT Surface Mount Technology Magazine. 2012 ; Vol. 27, No. 11. pp. 68-77.
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