Effect of cooling rate on the intermetallic layer in solder joints

Keith Sweatman, Tetsuro Nishimura, Stuart D. McDonald, Kazuhiro Nogita

Research output: Contribution to journalArticle

Abstract

In this paper the authors report a study of the effect of cooling rates on Cu 6Sn 5 crystals. Cooling rates from 200°C ranged from 10°C/minute to 100°C/minute and the effect of isothermal ageing at intermediate temperatures was also studied. The extent of the phase transformation after each regime was determined using synchrotron X-ray diffraction.

Original languageEnglish
Pages (from-to)68-77
Number of pages10
JournalSMT Surface Mount Technology Magazine
Volume27
Issue number11
Publication statusPublished - Nov 2012
Externally publishedYes

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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  • Cite this

    Sweatman, K., Nishimura, T., McDonald, S. D., & Nogita, K. (2012). Effect of cooling rate on the intermetallic layer in solder joints. SMT Surface Mount Technology Magazine, 27(11), 68-77.