Effect of Cu and Ni addition on high temperature deformation behavior in Sn-Cu-Ni solder alloys

Masayuki Takano, Keiji Kuroda, Kohei Hase, Shuuto Tanaka, Shigeto Yamasaki, Masatoshi Mitsuhara, Hideharu Nakashima

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

In recent years, it has become necessary to develop lead substitutes, such as lead-free solder alloys, because of increased environmental concerns regarding the use of leaded materials. In addition, electronic components that use lead-free solder alloys will need to be smaller and usable at higher operating temperatures in next-generation semiconductor devices. Therefore, lead-free solder alloys must be made more reliable. In this work, tin-copper-nickel( Sn-Cu-Ni) solder alloys, Sn-Cu solder alloys, and Sn-Ni solder alloys, as well as 99.96 mass% pure Sn, were subjected to tensile testing. The results showed the effects of adding Cu and Ni to Sn on the high-temperature deformation behavior of the Sn-Cu-Ni solder alloys. For each alloy and Sn, the stress exponent was estimated to be <5. This result indicated that, in each sample, the high-temperature deformation was controlled by dislocation creep. Furthermore, the creep activation energy was dependent on stress, and was affected to the greatest extent when adding Cu.

Original languageEnglish
Pages (from-to)337-344
Number of pages8
JournalNippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Volume81
Issue number7
DOIs
Publication statusPublished - Jan 1 2017

Fingerprint

solders
Soldering alloys
Temperature
Creep
Tin
Tensile testing
Semiconductor devices
Nickel
operating temperature
semiconductor devices
Copper
tin
Activation energy
Lead
nickel
exponents
substitutes
activation energy
copper
electronics

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Mechanics of Materials
  • Metals and Alloys
  • Materials Chemistry

Cite this

Effect of Cu and Ni addition on high temperature deformation behavior in Sn-Cu-Ni solder alloys. / Takano, Masayuki; Kuroda, Keiji; Hase, Kohei; Tanaka, Shuuto; Yamasaki, Shigeto; Mitsuhara, Masatoshi; Nakashima, Hideharu.

In: Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals, Vol. 81, No. 7, 01.01.2017, p. 337-344.

Research output: Contribution to journalArticle

@article{f96032daf6554b39b6b661956e34df18,
title = "Effect of Cu and Ni addition on high temperature deformation behavior in Sn-Cu-Ni solder alloys",
abstract = "In recent years, it has become necessary to develop lead substitutes, such as lead-free solder alloys, because of increased environmental concerns regarding the use of leaded materials. In addition, electronic components that use lead-free solder alloys will need to be smaller and usable at higher operating temperatures in next-generation semiconductor devices. Therefore, lead-free solder alloys must be made more reliable. In this work, tin-copper-nickel( Sn-Cu-Ni) solder alloys, Sn-Cu solder alloys, and Sn-Ni solder alloys, as well as 99.96 mass{\%} pure Sn, were subjected to tensile testing. The results showed the effects of adding Cu and Ni to Sn on the high-temperature deformation behavior of the Sn-Cu-Ni solder alloys. For each alloy and Sn, the stress exponent was estimated to be <5. This result indicated that, in each sample, the high-temperature deformation was controlled by dislocation creep. Furthermore, the creep activation energy was dependent on stress, and was affected to the greatest extent when adding Cu.",
author = "Masayuki Takano and Keiji Kuroda and Kohei Hase and Shuuto Tanaka and Shigeto Yamasaki and Masatoshi Mitsuhara and Hideharu Nakashima",
year = "2017",
month = "1",
day = "1",
doi = "10.2320/jinstmet.J2016069",
language = "English",
volume = "81",
pages = "337--344",
journal = "Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals",
issn = "0021-4876",
publisher = "公益社団法人 日本金属学会",
number = "7",

}

TY - JOUR

T1 - Effect of Cu and Ni addition on high temperature deformation behavior in Sn-Cu-Ni solder alloys

AU - Takano, Masayuki

AU - Kuroda, Keiji

AU - Hase, Kohei

AU - Tanaka, Shuuto

AU - Yamasaki, Shigeto

AU - Mitsuhara, Masatoshi

AU - Nakashima, Hideharu

PY - 2017/1/1

Y1 - 2017/1/1

N2 - In recent years, it has become necessary to develop lead substitutes, such as lead-free solder alloys, because of increased environmental concerns regarding the use of leaded materials. In addition, electronic components that use lead-free solder alloys will need to be smaller and usable at higher operating temperatures in next-generation semiconductor devices. Therefore, lead-free solder alloys must be made more reliable. In this work, tin-copper-nickel( Sn-Cu-Ni) solder alloys, Sn-Cu solder alloys, and Sn-Ni solder alloys, as well as 99.96 mass% pure Sn, were subjected to tensile testing. The results showed the effects of adding Cu and Ni to Sn on the high-temperature deformation behavior of the Sn-Cu-Ni solder alloys. For each alloy and Sn, the stress exponent was estimated to be <5. This result indicated that, in each sample, the high-temperature deformation was controlled by dislocation creep. Furthermore, the creep activation energy was dependent on stress, and was affected to the greatest extent when adding Cu.

AB - In recent years, it has become necessary to develop lead substitutes, such as lead-free solder alloys, because of increased environmental concerns regarding the use of leaded materials. In addition, electronic components that use lead-free solder alloys will need to be smaller and usable at higher operating temperatures in next-generation semiconductor devices. Therefore, lead-free solder alloys must be made more reliable. In this work, tin-copper-nickel( Sn-Cu-Ni) solder alloys, Sn-Cu solder alloys, and Sn-Ni solder alloys, as well as 99.96 mass% pure Sn, were subjected to tensile testing. The results showed the effects of adding Cu and Ni to Sn on the high-temperature deformation behavior of the Sn-Cu-Ni solder alloys. For each alloy and Sn, the stress exponent was estimated to be <5. This result indicated that, in each sample, the high-temperature deformation was controlled by dislocation creep. Furthermore, the creep activation energy was dependent on stress, and was affected to the greatest extent when adding Cu.

UR - http://www.scopus.com/inward/record.url?scp=85021372648&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85021372648&partnerID=8YFLogxK

U2 - 10.2320/jinstmet.J2016069

DO - 10.2320/jinstmet.J2016069

M3 - Article

AN - SCOPUS:85021372648

VL - 81

SP - 337

EP - 344

JO - Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals

JF - Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals

SN - 0021-4876

IS - 7

ER -