Effect of current density and organic additives on the texture and hardness of Ni electrodeposited from sulfamate and watt's solutions

Feng Yang, Wenhuai Tian, Hiroaki Nakano, Hideaki Tsuji, Satoshi Oue, Hisaaki Fukushima

Research output: Contribution to journalArticlepeer-review

18 Citations (Scopus)

Abstract

Ni electrodeposition was galvanostotically conducted over the current density range 500-2000 A/m2 in unagitated sulfamate and Watt's solutions at 323 and 313 K, respectively, to examine the effect of current density and organic additives on the texture, crystal orientation, and hardness of the deposited Ni. The overpotential for Ni deposition increased by the addition of polyethylene glycol (PEG) or saccharin in both sulfamate and Watt's solutions. The degree of increase in the overpotential in a PEG-containing solution was larger than that in a saccharincontaining solution. Ni deposited from an additive-free solution showed a morphology of field oriented texture type with the preferred orientation of the {100} plane, while Ni obtained from a PEG- or saccharin-containing solution had the unoriented dispersed type without a preferred orientation in the region of some current densities. The region of the current density that resulted in the unoriented dispersed type in Watt's solution was larger than that in a sulfamate solution. The particle size of the deposited Ni decreased with the addition of PEG and saccharin. The hardness of the deposited Ni increased with PEG and saccharin, and was higher for the unoriented dispersed texture than for the field oriented texture. In additive-containing solutions, the hardness of Ni deposited from Watt's solution was higher than that from a sulfamate solution.

Original languageEnglish
Pages (from-to)948-956
Number of pages9
JournalMaterials Transactions
Volume51
Issue number5
DOIs
Publication statusPublished - May 2010

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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