Effect of fullerene poly-hydroxide on Cu-CMP process

Hirotaka Kishida; Terutake Hayashi; Yasuhiro Takaya; Ken Kokubo; Keisuke Suzuki

Effect of fullerene poly-hydroxide on Cu-CMP process

Hirotaka Kishida, Terutake Hayashi, Yasuhiro Takaya, Ken Kokubo, Keisuke Suzuki

Research output: Contribution to conference › Paper › peer-review

Abstract

A novel CMP process using poly-hydroxylated Mierene (C₆₀(OH) ₃₆) is proposed. It has been previously reported that a copper surface can be improved considerably using C₆₀(OH)₃₆ molecules as abrasive grains. In this report, the chemical effect of fullerene hydroxide C₆₀(OH)₃₆ used for the CMP process is discussed. It was found that a copper-C₆₀(OH)₃₆ complex layer is formed by the reaction of hydrogen peroxide and C₆₀(OH)₃₆; the removal of this layer is the removal mechanism of matter using fullerene poly-hydroxide used in the Cu-CMP process.

Original language	English
Publication status	Published - 2009
Externally published	Yes
Event	5th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2009 - Osaka, Japan Duration: Dec 2 2009 → Dec 4 2009

Other

Other	5th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2009
Country/Territory	Japan
City	Osaka
Period	12/2/09 → 12/4/09

All Science Journal Classification (ASJC) codes

Industrial and Manufacturing Engineering

Cite this

@conference{69513ad31c7e4560a96850d88dd57798,

title = "Effect of fullerene poly-hydroxide on Cu-CMP process",

abstract = "A novel CMP process using poly-hydroxylated Mierene (C60(OH) 36) is proposed. It has been previously reported that a copper surface can be improved considerably using C60(OH)36 molecules as abrasive grains. In this report, the chemical effect of fullerene hydroxide C60(OH)36 used for the CMP process is discussed. It was found that a copper-C60(OH)36 complex layer is formed by the reaction of hydrogen peroxide and C60(OH)36; the removal of this layer is the removal mechanism of matter using fullerene poly-hydroxide used in the Cu-CMP process.",

author = "Hirotaka Kishida and Terutake Hayashi and Yasuhiro Takaya and Ken Kokubo and Keisuke Suzuki",

year = "2009",

language = "English",

note = "5th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2009 ; Conference date: 02-12-2009 Through 04-12-2009",

}

TY - CONF

T1 - Effect of fullerene poly-hydroxide on Cu-CMP process

AU - Kishida, Hirotaka

AU - Hayashi, Terutake

AU - Takaya, Yasuhiro

AU - Kokubo, Ken

AU - Suzuki, Keisuke

PY - 2009

Y1 - 2009

N2 - A novel CMP process using poly-hydroxylated Mierene (C60(OH) 36) is proposed. It has been previously reported that a copper surface can be improved considerably using C60(OH)36 molecules as abrasive grains. In this report, the chemical effect of fullerene hydroxide C60(OH)36 used for the CMP process is discussed. It was found that a copper-C60(OH)36 complex layer is formed by the reaction of hydrogen peroxide and C60(OH)36; the removal of this layer is the removal mechanism of matter using fullerene poly-hydroxide used in the Cu-CMP process.

AB - A novel CMP process using poly-hydroxylated Mierene (C60(OH) 36) is proposed. It has been previously reported that a copper surface can be improved considerably using C60(OH)36 molecules as abrasive grains. In this report, the chemical effect of fullerene hydroxide C60(OH)36 used for the CMP process is discussed. It was found that a copper-C60(OH)36 complex layer is formed by the reaction of hydrogen peroxide and C60(OH)36; the removal of this layer is the removal mechanism of matter using fullerene poly-hydroxide used in the Cu-CMP process.

UR - http://www.scopus.com/inward/record.url?scp=84883389789&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84883389789&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:84883389789

T2 - 5th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2009

Y2 - 2 December 2009 through 4 December 2009

ER -

Effect of fullerene poly-hydroxide on Cu-CMP process

Abstract

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All Science Journal Classification (ASJC) codes

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