Effect of fullerene poly-hydroxide on Cu-CMP process

Hirotaka Kishida, Terutake Hayashi, Yasuhiro Takaya, Ken Kokubo, Keisuke Suzuki

Research output: Contribution to conferencePaperpeer-review

1 Citation (Scopus)

Abstract

A novel CMP process using poly-hydroxylated Mierene (C60(OH) 36) is proposed. It has been previously reported that a copper surface can be improved considerably using C60(OH)36 molecules as abrasive grains. In this report, the chemical effect of fullerene hydroxide C60(OH)36 used for the CMP process is discussed. It was found that a copper-C60(OH)36 complex layer is formed by the reaction of hydrogen peroxide and C60(OH)36; the removal of this layer is the removal mechanism of matter using fullerene poly-hydroxide used in the Cu-CMP process.

Original languageEnglish
Publication statusPublished - 2009
Externally publishedYes
Event5th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2009 - Osaka, Japan
Duration: Dec 2 2009Dec 4 2009

Other

Other5th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2009
CountryJapan
CityOsaka
Period12/2/0912/4/09

All Science Journal Classification (ASJC) codes

  • Industrial and Manufacturing Engineering

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