Effect of groove pattern of chemical mechanical polishing pad on slurry flow behavior

Tsutomu Yamazaki, Toshiro K. Doi, Michio Uneda, Syuhei Kurokawa, Osamu Ohnishi, Kiyoshi Seshimo, Hideo Aida

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

In chemical mechanical polishing (CMP), the slurry flow behavior on the polishing pad is very important both for improving polishing effectiveness and for reducing the slurry consumption. In this study, we aim to evaluate two types of CMP pad that have unique special groove patterns, slurry outflow and inflow pads, for controlling the slurry flow behavior. We describe the effect of the groove patterns on the slurry flow behavior observed using images recorded using a high-speed digital camera. The results of the study indicate several advantages of the proposed pads over the conventional pads from the viewpoint of slurry flow behavior.

Original languageEnglish
Article number05EF03
JournalJapanese journal of applied physics
Volume51
Issue number5 PART 2
DOIs
Publication statusPublished - May 1 2012

All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Physics and Astronomy(all)

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