Abstract
In chemical mechanical polishing (CMP), the slurry flow behavior on the polishing pad is very important both for improving polishing effectiveness and for reducing the slurry consumption. In this study, we aim to evaluate two types of CMP pad that have unique special groove patterns, slurry outflow and inflow pads, for controlling the slurry flow behavior. We describe the effect of the groove patterns on the slurry flow behavior observed using images recorded using a high-speed digital camera. The results of the study indicate several advantages of the proposed pads over the conventional pads from the viewpoint of slurry flow behavior.
| Original language | English |
|---|---|
| Article number | 05EF03 |
| Journal | Japanese Journal of Applied Physics |
| Volume | 51 |
| Issue number | 5 PART 2 |
| DOIs | |
| Publication status | Published - May 1 2012 |
Fingerprint
All Science Journal Classification (ASJC) codes
- Engineering(all)
- Physics and Astronomy(all)
Cite this
Effect of groove pattern of chemical mechanical polishing pad on slurry flow behavior. / Yamazaki, Tsutomu; Doi, Toshiro K.; Uneda, Michio; Kurokawa, Syuhei; Ohnishi, Osamu; Seshimo, Kiyoshi; Aida, Hideo.
In: Japanese Journal of Applied Physics, Vol. 51, No. 5 PART 2, 05EF03, 01.05.2012.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Effect of groove pattern of chemical mechanical polishing pad on slurry flow behavior
AU - Yamazaki, Tsutomu
AU - Doi, Toshiro K.
AU - Uneda, Michio
AU - Kurokawa, Syuhei
AU - Ohnishi, Osamu
AU - Seshimo, Kiyoshi
AU - Aida, Hideo
PY - 2012/5/1
Y1 - 2012/5/1
N2 - In chemical mechanical polishing (CMP), the slurry flow behavior on the polishing pad is very important both for improving polishing effectiveness and for reducing the slurry consumption. In this study, we aim to evaluate two types of CMP pad that have unique special groove patterns, slurry outflow and inflow pads, for controlling the slurry flow behavior. We describe the effect of the groove patterns on the slurry flow behavior observed using images recorded using a high-speed digital camera. The results of the study indicate several advantages of the proposed pads over the conventional pads from the viewpoint of slurry flow behavior.
AB - In chemical mechanical polishing (CMP), the slurry flow behavior on the polishing pad is very important both for improving polishing effectiveness and for reducing the slurry consumption. In this study, we aim to evaluate two types of CMP pad that have unique special groove patterns, slurry outflow and inflow pads, for controlling the slurry flow behavior. We describe the effect of the groove patterns on the slurry flow behavior observed using images recorded using a high-speed digital camera. The results of the study indicate several advantages of the proposed pads over the conventional pads from the viewpoint of slurry flow behavior.
UR - http://www.scopus.com/inward/record.url?scp=84861507283&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84861507283&partnerID=8YFLogxK
U2 - 10.1143/JJAP.51.05EF03
DO - 10.1143/JJAP.51.05EF03
M3 - Article
VL - 51
JO - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
JF - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
SN - 0021-4922
IS - 5 PART 2
M1 - 05EF03
ER -